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SiC Wafer Hand for Wafer Handling, Cleanroom Compatible, Corrosion Resistant, Customizable Interface
Product Details:
| Brand Name: | ZMSH |
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Detail Information |
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| Density: | 3.21g/cm ³ | Hardness: | 2500Vickers Hardness |
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| Grain Size: | 2~10μm | Chemical Purity: | 99.99995% |
| Heat Capacity: | 640J·kg-1 ·K-1 | Sublimation Temperature: | 2700℃ |
Product Description
Product Introduction of Wafer Hand
The SiC wafer hand is an end-effector designed for handling wafers with high hardness and thermal stability. Constructed from dense, high-purity silicon carbide, it offers excellent mechanical strength, corrosion resistance, thermal durability, and ultra-clean performance. It is ideal for handling advanced semiconductor substrates such as SiC, GaN, and sapphire in cleanroom and high-temperature environments.
Structure & Working Principle of Wafer Hand
The SiC wafer hand supports wafers by their edge or backside using fork-like structures or custom platforms. Optional vacuum suction, alignment grooves, or mechanical grips enable non-contact or minimal-contact transfer. Its high structural rigidity ensures dimensional stability during transport, enabling accurate wafer positioning and minimal contamination risk.
Application Fields of Wafer Hand
Wafer hands are widely used in the following semiconductor and optoelectronic processes:
1.Wafer transport systems (e.g., EFEM, FOUP loader, SMIF pod interfaces)
2.Wafer loading/unloading for lithography, etching, ion implantation, thermal processing
3.Wafer inspection, sorting, and classification tools
4.Die bonding, dicing, packaging, and final test stations
5.Precision handling in display panels, MEMS, and biochip fabrication
6.Suitable for Si, SiC, GaAs, GaN, sapphire and other substrates
Product Advantages of Wafer Hand
A: Supports 2-inch to 12-inch wafers; custom sizes are also available.
Q2: Will the wafer hand scratch or contaminate the wafer?
A: No. The hand is made from low-particle, wear-resistant materials with chamfered edges and cleanroom compliance.
Q3: Can it be integrated with robotic systems?
A: Yes, it supports various robotic interfaces (e.g., SECS/GEM, SEMI standards) and can be customized for specific systems.
Q4: What is the expected service life and maintenance requirement?
A: Designed for over 1 million operation cycles with minimal maintenance; periodic cleaning is sufficient.
Q5: Can it be customized based on different wafer materials (Si, SiC, Sapphire, etc.)?
A: Yes. We offer custom designs optimized for various wafer materials with appropriate support structures.
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