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Single Crystal Si Wafer Electronic Device Substrate Photolithography Layer 2"3"4"6"8"
Product Details:
| Place of Origin: | China |
| Brand Name: | ZMSH |
| Model Number: | Si wafer |
Payment & Shipping Terms:
| Minimum Order Quantity: | 10 |
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| Delivery Time: | 2-4 weeks |
| Payment Terms: | T/T |
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Detail Information |
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| Front Surface: | CMP Polished, Ra < 0.5 Nm (single Side Polished, SSP) | Thermal Expansion Coefficient: | 2.6·10-6°C -1 |
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| WARP: | 30 µm | RRV: | 8% (6mm) |
| Primary Flat Length: | 32.5 +/- 2.5 Mm | Secondary Flat Length: | 18.0 +/- 2.0 Mm |
| Thickness: | 525 Um +/- 20 Um (SSP) | Type/ Dopant: | P/ Boron |
| High Light: | Polished Single Crystal Semiconductor Substrate,Electronic Device Si Wafer,2" Single Crystal Si Wafer |
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Product Description
Product Description:
A silicon wafer, often referred to as a Si wafer, is a fundamental component in the semiconductor industry, playing a crucial role in the fabrication of electronic devices. Silicon, a semiconductor material, is used to manufacture these wafers due to its excellent electrical properties.
Silicon wafers are thin, disk-shaped substrates typically made from a single crystal of silicon. The production process involves growing a cylindrical ingot of crystalline silicon, which is then sliced into thin wafers using precision cutting techniques. The resulting wafers are polished to achieve a smooth and flat surface.
These wafers serve as the foundation for the creation of integrated circuits (ICs) and other semiconductor devices. The semiconductor fabrication process involves depositing various materials onto the silicon wafer, creating intricate patterns using photolithography, and etching to form transistors, diodes, and other electronic components.
Si wafers come in different sizes, with diameters commonly ranging from 100 to 300 millimeters. The choice of wafer size depends on industry standards and manufacturing requirements. Larger wafers enable higher production efficiency and lower costs per chip.
The semiconductor industry relies heavily on silicon wafers for the mass production of microchips used in electronic devices such as computers, smartphones, and various other electronic systems. Continuous advancements in technology have led to the development of smaller and more powerful semiconductor devices, driving the demand for high-quality silicon wafers.
In conclusion, silicon wafers are the building blocks of modern semiconductor devices, facilitating the production of integrated circuits that power the electronic devices we use daily. Their precision manufacturing and crucial role in the semiconductor industry make them a key element in the world of electronics.
Features:
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Crystal Structure: Si Wafers are typically grown from a single crystal of silicon, exhibiting a well-defined crystal lattice structure. This single-crystal structure is essential for the performance and stability of semiconductor devices.
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Purity: High purity is a critical characteristic of Si Wafers, with stringent control over impurities. High-purity silicon ensures the reliability and performance of semiconductor devices.
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Conductivity: Silicon is a semiconductor material, and its conductivity is influenced by doping. By introducing dopants, the electrical conductivity of silicon can be controlled for manufacturing electronic devices like transistors.
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Dimensions: Si Wafer dimensions are commonly described in terms of diameter and thickness. Common diameters include 100mm, 200mm, and 300mm, while thickness choices impact manufacturing processes and device design.
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Surface Smoothness: The surface of Si Wafers undergoes precise polishing to ensure flatness and smoothness. This is crucial for the accuracy of manufacturing processes such as photolithography.
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Coefficient of Thermal Expansion: The coefficient of thermal expansion of Si Wafers needs to match with other materials to prevent stress and deformation during temperature changes, ensuring device stability.
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Flatness: Flatness of Si Wafers is critical for manufacturing processes like photolithography, ensuring the accurate replication of patterns.
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Optical Transparency: In some applications, Si Wafers need to exhibit good optical transparency to support the manufacturing of optical devices.
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Chemical Stability: Si Wafers demonstrate relative stability in various chemical environments, making them ideal substrates for a variety of semiconductor processes.
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Processability: Si Wafers are easy to process and prepare, making them one of the most commonly used base materials in the semiconductor industry.
Technical Parameters:
| Technical Parameters | Value |
|---|---|
| Secondary Flat Length | 18.0 +/- 2.0 Mm |
| Substrate Material | Single Crystal Silicon Wafer |
| Electrical Resistivity | 10-20 Ohm-cm |
| Oxygen Content | 1.6 X 10^18 Atoms/cm3 |
| Type/ Dopant | P/ Boron |
| Thickness | 525 Um +/- 20 Um (SSP) |
| Primary Flat Orientation | <110> +/-1 Deg |
| Diameter | 100 Mm +/- 0.5 Mm |
| Front Surface | CMP Polished, Ra < 0.5 Nm (single Side Polished, SSP) |
| Growth Method | MCZ |
| Thin Film Technology | Ultra-thick Silicon Oxide Wafer |
| Applications | - |
Applications:
Integrated Circuits (ICs): Si wafers are the primary substrate for manufacturing integrated circuits used in electronic devices.
Transistors: Silicon wafers are crucial for the fabrication of transistors, fundamental components in electronic circuits.
Diodes: Si wafers serve as the foundation for the production of diodes, essential semiconductor devices with various applications.
Microprocessors: The manufacturing of microprocessors, the brains of computers and electronic devices, heavily relies on Si wafers.
Memory Devices: Si wafers are used to produce various types of memory devices, including RAM and flash memory.
Solar Cells: Silicon wafers are a key material in the production of solar cells, converting sunlight into electrical energy.
Optoelectronic Devices: Si wafers play a role in manufacturing optoelectronic devices such as light-emitting diodes (LEDs) and photodetectors.
Sensors: Silicon wafers are utilized in the fabrication of sensors for applications like pressure, temperature, and motion sensing.
MEMS Devices: Micro-Electro-Mechanical Systems (MEMS) devices, such as accelerometers and gyroscopes, are manufactured on Si wafers.
Power Devices: Si wafers contribute to the production of power semiconductor devices used in power electronics and electrical systems.
Radio-Frequency (RF) Devices: Si wafers are employed in the creation of RF devices for wireless communication and signal processing.
Microcontrollers: Si wafers are integral to the manufacturing of microcontrollers, found in a variety of electronic systems.
Analog Circuits: Silicon wafers are used to fabricate analog circuits for processing continuous signals in electronics.
Fiber Optic Components: Si wafers play a role in manufacturing components for fiber optic communication systems.
Biomedical Sensors: Silicon wafers are utilized in the production of sensors for biomedical applications, including glucose sensors and DNA microarrays.
Smartphones: Si wafers contribute to the production of semiconductor chips used in smartphones for various functions.
Automotive Electronics: Si wafers are used in manufacturing semiconductor components for automotive electronics, including engine control units.
Consumer Electronics: Various consumer electronics, such as TVs, cameras, and audio devices, incorporate Si wafers in their electronic components.
Wireless Communication Devices: Si wafers are essential for the production of chips used in wireless communication devices like routers and modems.
Digital Signal Processors (DSPs): Silicon wafers are employed in the manufacturing of DSPs, specialized microprocessors for digital signal processing applications.
Customization:
We specialize in providing customized Semiconductor Substrate services with the following attributes:
- Brand Name: ZMSH
- Model Number: Si wafer
- Place of Origin: China
- Thickness: 525 Um +/- 20 Um (SSP)
- Carbon Content: 0.5 Ppm
- Oxygen Content: 1.6 X 10^18 Atoms/cm3
- Secondary Flat Orientation: 90 Deg From Primary Flat
- Package: Packaged In A Class 100 Clean Room Environment, In Cassettes Of 25 Wafers.
- Surface oxidation: treated with a unique oxide layer for improved conductivity
- Conductivity: highly conductive material for semiconductor applications
- Semiconductor material: engineered to meet the highest standards for quality, reliability, and performance
Support and Services:
Semiconductor Substrate Technical Support and Service
At XYZ, we provide technical support and service for our semiconductor substrate products. Our team of experts are ready to assist you with any questions or concerns you may have regarding our products. We provide both online and phone support, and are available 24 hours a day, 7 days a week.
We also offer a comprehensive troubleshooting guide to help you find the solution to any issue you may be having with our products. If you need further assistance, our product specialists are available to provide personalized help.
If you ever need a replacement part, we also offer a wide selection of spare parts for all of our semiconductor substrates. We take pride in offering our customers the highest quality parts and service.
We strive to provide the best customer service possible and are committed to making sure you are completely satisfied with your purchase. If you have any questions or concerns, please do not hesitate to contact us.
Our Compamy
ZMSH is a high-tech enterprise specializing in the research, production, processing, and sales of Semiconductor substrates and optical crystal materials. Our products are widely used in Semiconductor, and optical electronics, consumer electronics, the military industry, as well as the fields of laser and optical communication.
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