Product Overview of Diamond-Copper Composite

The Diamond-Copper Composite, also known as Cu-Diamond Composite, is an advanced metal matrix composite that integrates the exceptional thermal conductivity of diamond with the outstanding electrical and mechanical properties of copper.

By embedding diamond particles into a copper matrix, this composite achieves ultra-high heat dissipation, tailored thermal expansion, and lightweight strength, making it one of the most effective materials for next-generation thermal management applications in semiconductors, laser systems, high-power modules, and aerospace electronics.

Working Principle of Diamond-Copper Composite

Diamond, with its extremely high thermal conductivity (up to 2000 W/m*K), acts as a superior heat-spreading filler within the copper matrix. Copper provides excellent electrical and mechanical bonding as well as processability.

Through chemical coating, vacuum infiltration, and hot pressing, a strong interface bond is formed between diamond particles and the copper phase. This structure allows efficient heat transfer while maintaining mechanical stability and electrical conductivity -- delivering a composite that effectively removes heat from critical components in microelectronics and power systems.

Key Properties of Diamond-Copper Composite

Manufacturing Process of Diamond-Copper Composite

Diamond-Copper composites are typically fabricated using one or a combination of the following advanced techniques:

• Powder Metallurgy (PM): Mixing and sintering of coated diamond particles with copper powder.
• Vacuum Infiltration: Molten copper is infiltrated into a diamond preform to ensure dense bonding.
• Spark Plasma Sintering (SPS): Enables rapid densification and excellent interfacial bonding.
• Reactive Sintering: Surface metallization (Ni, Cr, Ti) enhances wettability and prevents interface oxidation.

Each process is optimized to ensure high bonding strength, low porosity, and uniform diamond dispersion, resulting in stable thermal performance.

Typical Applications of Diamond-Copper Composite

Diamond-Copper composites are widely used as high-end thermal management substrates and heat spreaders in the following fields:

• High-power semiconductor packages (IGBT, MOSFET, RF devices)
• Laser diode and microwave module heat sinks
• Aerospace and defense electronic cooling systems
• High-brightness LED thermal baseplates
• CPU / GPU heat spreaders and integrated circuit packaging
• Optoelectronic and telecommunication devices

Product Advantages of Diamond-Copper Composite

• Exceptional Thermal Performance: Thermal conductivity up to 700 W/m*K ensures rapid heat dissipation.
• CTE Tunability: Tailored to match semiconductor materials, minimizing thermal stress and delamination.
• Lightweight and Durable: Lower density than Cu-W or Cu-Mo composites, ideal for aerospace systems.
• Excellent Surface Quality: Compatible with nickel or gold plating for brazing and bonding.
• Stable and Reliable: Superior oxidation resistance and long-term structural stability.

FAQ of Diamond-Copper Composite