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TGV Glass Substrate Through-hole Coating Semiconductor Packaging JGS1 JGS2

Sapphire Substrate
2025-05-20
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#sapphire wafer #silicon substrate #sapphire material
Product Overview TGV (Through Glass Via) technology, also known as glass through-hole technology, is a vertical electrical interconnection technique that penetrates glass substrates. It enables ... View More
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TGV Glass Substrate Through-hole Coating Semiconductor Packaging JGS1 JGS2
TGV Glass Substrate Through-hole Coating Semiconductor Packaging JGS1 JGS2
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