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Through Glass Vias (TGV) JGS1 JGS2 Sapphire BF33 Quartz Customizable Dimensions Thickness Can Low As 100 Μm

Sapphire Substrate
2025-05-08
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#sapphire wafer #silicon substrate #sapphire material
Through glass vias (TGV),JGS1 JGS2 sapphire BF33 quartz Customizable dimensions, thickness can low as 100 µm. Product abstract Our innovative Through-Glass Vias (TGV) technologies revolutionize ... View More
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Through Glass Vias (TGV) JGS1 JGS2 Sapphire BF33 Quartz Customizable Dimensions Thickness Can Low As 100 Μm
Through Glass Vias (TGV) JGS1 JGS2 Sapphire BF33 Quartz Customizable Dimensions Thickness Can Low As 100 Μm
Contact Now
Learn More
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