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Through Glass Vias (TGV) JGS1 JGS2 Sapphire BF33 Quartz Customizable Dimensions Thickness Can Low As 100 Μm

Sapphire Substrate

2025-08-20

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#sapphire wafer #silicon substrate #sapphire material

Through glass vias (TGV),JGS1 JGS2 sapphire BF33 quartz Customizable dimensions, thickness can low as 100 µm. Product abstract Our innovative Through-Glass Vias (TGV) technologies revolutionize ... View More

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Through Glass Vias (TGV) JGS1 JGS2 Sapphire BF33 Quartz Customizable Dimensions Thickness Can Low As 100 Μm

Through Glass Vias (TGV) JGS1 JGS2 Sapphire BF33 Quartz Customizable Dimensions Thickness Can Low As 100 Μm

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Learn More

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