Through Glass Vias (TGV) JGS1 JGS2 Sapphire BF33 Quartz Customizable Dimensions Thickness Can Low As 100 Μm

Through Glass Vias (TGV) JGS1 JGS2 Sapphire BF33 Quartz Customizable Dimensions Thickness Can Low As 100 Μm

Product Details:

Place of Origin: China
Brand Name: ZMSH
Model Number: Through glass vias (TGV)

Payment & Shipping Terms:

Minimum Order Quantity: 1
Delivery Time: 2-4 weeks
Payment Terms: T/T
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Detail Information

Glass Material: JGS1 JGS2 BF33 Sapphire Corning Wafer Size: Customizable
Panel Size: ~550x650mm (Gen.3) Sheet Thickness: 0.1mmt~0.5mmt
Hole Type: Through Via, Blind Via Hole Shape: Straight, Taper, Hourglass
Hole Diameter: φ20μm~φ150μm Pitch: MIN. Hole Diameter × 2
High Light:

Through Glass Vias JGS1 JGS2

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JGS1 JGS2 Sapphire BF33 Quartz

Product Description

Through glass vias (TGV),JGS1 JGS2 sapphire BF33 quartz Customizable dimensions, thickness can low as 100 µm.

Product abstract

Our innovative Through-Glass Vias (TGV) technologies revolutionize electrical interconnect solutions, offering unprecedented flexibility and performance across various high-tech industries. Utilizing a selection of premium materials such as JGS1, JGS2, sapphire, BF33, and quartz, our TGV products meet the stringent demands of precision and durability.

Through Glass Vias (TGV) JGS1 JGS2 Sapphire BF33 Quartz Customizable Dimensions Thickness Can Low As 100 Μm 0

Key Features and Advantages

  1. Material Diversity: Our TGV offerings are crafted from high-quality materials including JGS1 and JGS2 glasses, known for their exceptional optical clarity and thermal stability; sapphire, which provides outstanding hardness and scratch resistance; BF33 glass, renowned for its thermal and mechanical properties; and quartz, appreciated for its high purity and chemical resistance.

  2. Customization: We provide fully customizable dimensions tailored to client specifications, ensuring optimal integration with existing systems. The thickness of our TGV products can be as low as 100 µm, accommodating ultra-thin applications and enhancing device compactness.

  3. Enhanced Performance: The use of superior materials like sapphire and quartz in TGV technology significantly improves device performance by enhancing thermal management and reducing signal losses. This leads to more efficient operation and prolonged device life.

  4. Reliability and Durability: Our TGV products are engineered to withstand harsh conditions, making them suitable for use in high-reliability sectors such as aerospace, military, and medical devices. The resilience of materials like sapphire and JGS glass ensures long-term reliability and performance under extreme environmental conditions.

  5. Technological Superiority: Incorporating advanced TGV technology enhances the electrical performance by providing a direct pathway for signal and power transmission through the substrate, which minimizes impedance and increases the speed of electronic devices.

  6. Market Flexibility: Suitable for a wide range of applications from consumer electronics to specialized industrial equipment, our TGV products are versatile and adaptable to both mass-market and niche technological needs.

Our advanced TGV technology, coupled with our commitment to customization and quality, makes us a leader in the field, ready to meet the evolving challenges of modern industries. Choose our TGV solutions for unparalleled performance and reliability.

Through Glass Vias (TGV) JGS1 JGS2 Sapphire BF33 Quartz Customizable Dimensions Thickness Can Low As 100 Μm 1

 

 

Material characteristics

Our Through-Glass Vias (TGV) products are engineered using top-tier materials such as JGS1, JGS2, sapphire, BF33, and quartz, each chosen for its unique properties that enhance device functionality and durability. These materials allow for customizable dimensions, with thicknesses that can be reduced to as low as 100 µm, facilitating integration into various device architectures without compromising performance.

  • JGS1 and JGS2: Both materials are known for their excellent optical transparency and high thermal stability, making them suitable for applications requiring minimal optical distortion and high temperature resistance.
  • Sapphire: This material is incredibly durable and offers exceptional scratch resistance and hardness, ideal for environments where physical wear and tear are concerns.
  • BF33: Known for its robust mechanical properties and thermal stability, BF33 is optimal for applications that undergo frequent temperature fluctuations.
  • Quartz: With its high purity and low thermal expansion, quartz is excellent for high-precision applications that require stable, reliable performance under thermal stress.

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Through Glass Vias (TGV) JGS1 JGS2 Sapphire BF33 Quartz Customizable Dimensions Thickness Can Low As 100 Μm 2Through Glass Vias (TGV) JGS1 JGS2 Sapphire BF33 Quartz Customizable Dimensions Thickness Can Low As 100 Μm 3Through Glass Vias (TGV) JGS1 JGS2 Sapphire BF33 Quartz Customizable Dimensions Thickness Can Low As 100 Μm 4Through Glass Vias (TGV) JGS1 JGS2 Sapphire BF33 Quartz Customizable Dimensions Thickness Can Low As 100 Μm 5

Working Principle of TGV Technology

Glass Substrate Selection: Initially, suitable glass materials such as JGS1, JGS2, BF33, or quartz are selected. These materials are chosen for their excellent optical, electrical, and thermal stability characteristics.

 

Drilling: Techniques such as laser drilling, ultrasonic drilling, or photolithography are used to precisely create vias in the glass substrate. The diameter and placement of these vias are controlled according to design requirements.

Metalization of Vias: To enable the vias to conduct electrical signals, their inner walls are coated with a metal layer. Common metallization materials include copper, tungsten, or gold. The metallization process may involve chemical vapor deposition (CVD), physical vapor deposition (PVD), or electroplating.

Packaging and Interconnection: Once metallization is complete, the vias in the glass can directly connect to circuits on semiconductor chips or other electronic components. This vertical interconnection approach helps reduce wiring space and enhance integration.

Testing and Encapsulation: After metallization and interconnection are complete, the entire assembly is tested to ensure that the electrical performance meets specifications. Subsequently, the assembly is encapsulated to provide physical and environmental protection.

 

Advantages of TGV Technology:

Reduced Signal Path Length: By making direct connections through the glass substrate, signal path length is significantly reduced, thereby lowering signal delay and improving processing speed.

Increased Device Density and Functional Integration: TGV allows for more compact layouts, aiding in the increase of functional density in electronic devices.

Enhanced Thermal Management: Metallized vias effectively conduct heat, aiding in improved thermal management of the chip.

Enhanced Dvice Reliability: TGV technology enhances overall device reliability and durability by reducing the number of interconnections and their complexity.

TGV technology provides an efficient and reliable interconnection solution for modern microelectronic devices, particularly suitable for applications requiring high performance and reliability, such as aerospace, military, and advanced communication systems.

Application Summary

Through-Glass Vias (TGV) technologies are reshaping the landscape of various high-tech industries by providing innovative, customizable, and high-performance interconnect solutions. Our advanced TGV products utilize top-tier materials such as JGS1, JGS2, sapphire, BF33, and quartz, each chosen for their unique properties to meet diverse application needs across different sectors.

Aerospace and Aviation:In aerospace applications, reliability and precision are paramount. Our TGV technology, using materials like sapphire and BF33 glass, offers exceptional durability and resistance to extreme environmental conditions. This ensures reliable performance in critical systems such as avionics, satellite communications, and spacecraft instrumentation, where failure is not an option.

Military and Defense:For military applications, our TGV products provide robust and secure communication links in equipment exposed to harsh operational conditions. The thermal and mechanical stability of JGS glasses makes them ideal for use in ruggedized electronics, targeting systems, and secure communication devices that require consistent performance in varying climates and under physical stress.

Medical Devices:In the medical sector, the precision and biocompatibility of materials like quartz and sapphire are crucial. Our TGV solutions enhance the functionality of diagnostic and therapeutic devices, such as imaging systems and wearable health monitors. The ultra-thin, customizable dimensions of our TGV products allow for their integration into compact medical devices, improving patient comfort and device efficacy.

Consumer Electronics:Our technology significantly benefits consumer electronics by enabling thinner, more efficient devices. The customizable thickness down to 100 µm allows for sleeker designs in smartphones, tablets, and wearable technology. The superior electrical performance facilitated by our TGVs enhances device speed and battery life, offering consumers more powerful and reliable gadgets.

Industrial and Scientific Instrumentation:In industrial and scientific applications, the chemical resistance of quartz and the optical clarity of JGS glasses make our TGV products ideal for sensors and instrumentation in harsh chemical environments or precision optical systems. They provide reliable and accurate data transmission, essential for industrial automation systems and laboratory equipment.

 

Our TGV technologies, supported by a range of high-quality materials and customization options, are pivotal in advancing the capabilities of devices across multiple sectors. By choosing our TGV solutions, industries can leverage the benefits of enhanced performance, increased reliability, and greater flexibility, ready to meet the demands of modern technology and innovation.

 

 

Key words:

  1. Through-Glass Vias (TGV)

  2. TGV glass

  3. TGV sapphire

  4. Interconnect Solutions

  5. Advanced Semiconductor Technology

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