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High-Transmittance TGV Sapphire Substrate Conductive Aerospace Automotive AR VR
Product Details:
| Place of Origin: | China |
| Brand Name: | ZMSH |
Payment & Shipping Terms:
| Minimum Order Quantity: | 1 |
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| Payment Terms: | T/T |
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Detail Information |
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| Material: | Single-crystal Sapphire (C-plane, A-plane Optional) | Thickness: | 100 μm – 1000 μm |
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| Via Diameter: | ≥ 20 μm | Aspect Ratio: | ≥ 10:1 |
| Surface Roughness: | Ra < 1 Nm (polishing Available) | Package Compatibility: | Fan-out, Flip-chip, MEMS Packaging, Etc. |
| Highlight: | Automotive Sapphire Substrate,Conductive Sapphire Substrate,High-Transmittance Sapphire Substrate |
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Product Description
Product Overview
TGV Sapphire is a transparent conductive glass material based on sapphire (Al₂O₃) substrates, coated with transparent conductive oxide (TCO) films (e.g., ITO, AZO) via magnetron sputtering. TGV Sapphire combines sapphire’s ultra-high hardness, high-temperature resistance, and TCO films’ conductivity and transparency, making it ideal for high-performance electronic devices in extreme environments.
Principle
Using laser drilling or dry etching, vertical vias with high aspect ratios are created in the sapphire substrate. These vias are metallized to enable vertical electrical signal transmission, while maintaining the sapphire’s optical clarity and mechanical integrity.
Sapphire Substrate: Sapphire (Al₂O₃) is one of the hardest oxide materials in nature, offering exceptional chemical stability, high thermal conductivity (~40 W/m·K), and a wide optical bandgap (~9.9 eV), enabling resistance to high temperatures and harsh chemical environments.
Transparent Conductive Layer: A nano-scale TCO film (e.g., ITO) is deposited on the sapphire surface via physical vapor deposition (PVD), balancing high transmittance (>90%) and low sheet resistance (≤10 Ω/sq).
Technical Challenges
Extreme Hardness
Sapphire has a Mohs hardness of 9 (second only to diamond), making traditional mechanical drilling tools (e.g., tungsten carbide drills) prone to rapid wear or even ineffective.
Brittle Fracture Risk
Sapphire’s single-crystal structure makes it susceptible to micro-cracks, edge chipping, or delamination during machining, compromising hole-wall quality and device reliability.
Micro-Hole Requirements
For LED chips or MEMS sensors, holes with diameters <100 μm are often needed, requiring precision within ±1 μm.
Thermal Damage Control
High-temperature processes (e.g., laser drilling) may cause localized melting or thermal stress cracks.
Specification
| Item | Typical Values (Customizable) |
|---|---|
| Material | Single-crystal Sapphire (C-plane, A-plane optional) |
| Thickness | 100 μm – 1000 μm |
| Via Diameter | ≥ 20 μm |
| Aspect Ratio | ≥ 10:1 |
| Via Density | > 1,000,000 vias/cm² (optional) |
| Metallization | Ti/Cu, Ni/Au, Pt, etc. |
| Surface Roughness | Ra < 1 nm (polishing available) |
| Package Compatibility | Fan-out, Flip-chip, MEMS packaging, etc. |
Applications
Consumer Electronics: Scratch-resistant AR/VR displays, flexible OLED backplanes.
Optoelectronics: Laser window components, UV sensors, high-power LED substrates.
Automotive: Automotive displays, LiDAR optical components.
Aerospace: Radiation-resistant satellite parts and spacecraft windows.
Q&A
Q1: What’s the difference between TGV Sapphire and ordinary conductive glass?
A1: TGV Sapphire is 10x harder than regular glass, withstands temperatures up to 600℃, and operates in harsh chemical environments.
Q2: Can TGV Sapphire be customized (e.g., shape cutting, thickness adjustment)?
A2: Yes, customizable dimensions, thickness (0.5mm~5mm), and conductive layer patterns are available.
Q3: Does extreme temperature affect TGV Sapphire conductivity?
A3: Sapphire’s CTE matches silicon chips, ensuring stable conductivity under high temperatures.
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