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Semiconductor Substrate
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VGF 2 Inch 4Inch N / P Type GaAs Wafer Semiconductor Substrate For Epitaxial Growth

VGF 2 Inch 4Inch N / P Type GaAs Wafer Semiconductor Substrate For Epitaxial Growth

Brand Name: ZMSH
Model Number: GaAs substrate
MOQ: 3PCS
Price: BY case
Packaging Details: single wafer container under cleaning room
Payment Terms: T/T, Western Union
Detail Information
Place of Origin:
CN
Certification:
ROHS
Material:
GaAs Substrate Wafer
Size:
2inch 3inch 4inch 6inch
Growth Method:
VGF
EPD:
<500
Dopant:
Si-doped Zn-doped Undoped
TTV DDP:
5um
TTV SSP:
10um
Orientation:
100+/-0.1 Degree
Highlight:

Epitaxial Growth Semiconductor Substrate

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P Type GaAs Wafer

,

GaAs Wafer Semiconductor Substrate

Product Description

VGF 2 Inch 4Inch N Type P Type GaAs Wafer Semiconductor Substrate For Epitaxial Growth

 

VGF 2inch 4inch 6inch n-type prime grade GaAs wafer for epitaxial growth

Gallium arsenide can be made into semi-insulating high-resistance materials with resistivity more than 3 orders of magnitude higher than silicon and germanium, which are used to make integrated circuit substrates, infrared detectors, gamma photon detectors, etc. Because its electron mobility is 5 to 6 times greater than that of silicon, it has important applications in the manufacture of microwave devices and high-speed digital circuits. Gallium arsenide made of gallium arsenide can be made into semi-insulating high-resistance materials with resistivity of more than 3 orders of magnitude higher than silicon and germanium, which are used to make integrated circuit substrates and infrared detectors.

1. Application of gallium arsenide in optoelectronics

2. Application of gallium arsenide in microelectronics

3. Application of gallium arsenide in communication

4. Application of gallium arsenide in microwave

5. Application of gallium arsenide in solar cells

GaAs Wafers Specification

Type/Dopant  Semi-Insulated P-Type/Zn N-Type/Si N-Type/Si
Application  Micro Eletronic LED Laser Diode
Growth Method  VGF
Diameter  2", 3", 4", 6"
Orientation  (100)±0.5°
Thickness  (µm) 350-625um±25um
OF/IF  US EJ or Notch
Carrier Concentration  - (0.5-5)*1019 (0.4-4)*1018 (0.4-0.25)*1018
Resistivity  (ohm-cm) >107 (1.2-9.9)*10-3 (1.2-9.9)*10-3 (1.2-9.9)*10-3
Mobility  (cm2/V.S.) >4000 50-120 >1000 >1500
Etch Pitch Density (/cm2) <5000 <5000 <5000 <500
TTV  [P/P] (µm) <5
TTV [P/E] (µm) <10
Warp  (µm) <10
Surface Finished P/P, P/E, E/E
Note: Other Specifications may be available upon request
 

Gallium arsenide is the most important and widely used semiconductor material in compound semiconductors, and it is also the most mature and the largest compound semiconductor material in production at present.

Gallium arsenide devices that have been used are:

  • Microwave diode, Gunn diode, varactor diode, etc.
  • Microwave transistors: field effect transistor (FET), high electron mobility transistor (HEMT), heterojunction bipolar transistor (HBT), etc.
  • Integrated circuit: microwave monolithic integrated circuit (MMIC), ultra-high speed integrated circuit (VHSIC), etc.
  • Hall components, etc. 
  • Infrared light-emitting diode (IR LED); Visible light-emitting diode (LED, used as substrate);
  • Laser diode (LD);
  • Light detector;
  • High-efficiency solar cell;

VGF 2 Inch 4Inch N / P Type GaAs Wafer Semiconductor Substrate For Epitaxial Growth 0VGF 2 Inch 4Inch N / P Type GaAs Wafer Semiconductor Substrate For Epitaxial Growth 1VGF 2 Inch 4Inch N / P Type GaAs Wafer Semiconductor Substrate For Epitaxial Growth 2