Infrared picosecond dual-platform glasslaser cuttingequipment

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April 15, 2025
Category Connection: Scientific Lab Equipment
Brief: Discover the Infrared Picosecond Dual-platform Glass Laser Cutting Equipment, designed for high-precision cutting of quartz and sapphire. This advanced system uses ultra-short picosecond laser pulses for clean, crack-free cuts with minimal thermal damage, ideal for semiconductor and optical applications.
Related Product Features:
  • High-precision cutting with ultra-short picosecond laser pulses for minimal thermal damage.
  • Dual-platform design for flexible and efficient processing of hard and brittle materials.
  • Capable of cutting quartz, sapphire, optical glass, and other brittle materials with precision.
  • Customizable platform sizes (700*1200mm or 900*1400mm) to suit various production needs.
  • High-speed processing of special-shaped workpieces improves efficiency.
  • Clean cuts with no taper, small edge collapse, and no hand injuries.
  • Low operating costs, high yield rate, and no consumables or pollution.
  • Seamless switching between product specifications with simple operation.
Faqs:
  • What materials can the Infrared Picosecond Dual-platform Glass Laser Cutting Equipment process?
    It can process hard and brittle materials like quartz, sapphire, optical glass, reinforced glass, filters, and mirrors.
  • What are the advantages of using picosecond laser technology for cutting?
    Picosecond laser technology provides clean, crack-free cuts with minimal thermal damage, ensuring high precision and quality.
  • Can the platform size be customized?
    Yes, the platform size can be customized to meet specific production requirements, with options like 700*1200mm or 900*1400mm.