Brief: Discover the Infrared Picosecond Dual-platform Glass Laser Cutting Equipment, designed for high-precision cutting of quartz and sapphire. This advanced system uses ultra-short picosecond laser pulses for clean, crack-free cuts with minimal thermal damage, ideal for semiconductor and optical applications.
Related Product Features:
High-precision cutting with ultra-short picosecond laser pulses for minimal thermal damage.
Dual-platform design for flexible and efficient processing of hard and brittle materials.
Capable of cutting quartz, sapphire, optical glass, and other brittle materials with precision.
Customizable platform sizes (700*1200mm or 900*1400mm) to suit various production needs.
High-speed processing of special-shaped workpieces improves efficiency.
Clean cuts with no taper, small edge collapse, and no hand injuries.
Low operating costs, high yield rate, and no consumables or pollution.
Seamless switching between product specifications with simple operation.
Faqs:
What materials can the Infrared Picosecond Dual-platform Glass Laser Cutting Equipment process?
It can process hard and brittle materials like quartz, sapphire, optical glass, reinforced glass, filters, and mirrors.
What are the advantages of using picosecond laser technology for cutting?
Picosecond laser technology provides clean, crack-free cuts with minimal thermal damage, ensuring high precision and quality.
Can the platform size be customized?
Yes, the platform size can be customized to meet specific production requirements, with options like 700*1200mm or 900*1400mm.