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Ti Cu Silicon Wafers Enhanced Conductivity

January 09, 2026
Discover our high-quality Ti/Cu metal-coated silicon wafers, engineered for superior performance in research and industrial prototyping. These wafers feature a robust titanium adhesion layer for excellent film adherence and a copper conductive layer for exceptional electrical conductivity.

Fabricated using standard magnetron sputtering, our Ti/Cu wafers offer a stable, repeatable process with a low-resistance surface ideal for subsequent lithography, electroplating, and device fabrication. We offer a wide range of customization options, including various wafer sizes (2", 4", 6", 8"), conductivity types (P-type, N-type), crystal orientations, resistivity ranges, and film thicknesses.

Whether you need them for ohmic contacts, electrodes, seed layers for electroplating, nanomaterial research, or bio/chemical platforms, our Ti/Cu coated silicon wafers provide the reliability and performance you need.

Explore the advantages:
✅ Excellent adhesion with Ti interlayer
✅ High conductivity and uniform Cu surface
✅ Flexible customization options
✅ Stable and repeatable sputtering process

Contact us today to discuss your specific requirements and get a quote for your custom Ti/Cu metal-coated silicon wafers!
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