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Green Laser Diamond Cutting System

Green Laser Diamond Cutting System

Brand Name: ZMSH
MOQ: 1
Price: by case
Packaging Details: custom cartons
Payment Terms: T/T
Detail Information
Place of Origin:
China
Supply Ability:
By case
Product Description

Product Overview

The SY-CVD11E is a 532 nm green laser cutting system designed for precision cutting/slicing of superhard materials. The provided material indicates typical applications include natural diamond, lab-grown diamond, and other superhard materials such as CVD, PCD, MCD, and CBN.

 

Green Laser Diamond Cutting System 0


Why 532 nm Green Laser (Key Processing Advantages)

Green laser (532 nm) in this system is generated by frequency doubling of 1064 nm. The material emphasizes that, compared with 1064 nm (described as “red laser” in the document), 532 nm provides:

  • Higher processing efficiency;

  • Smoother cut surfaces;

  • Reduced graphitization (lower undesired graphitization during processing).

These points are positioned as practical benefits for achieving better cut quality and more stable results when processing diamond and similar superhard materials.

Green Laser Diamond Cutting System 1     Green Laser Diamond Cutting System 2

 


Mechanical & Optical Stability Design

To enhance long-term stability and precision, the machine uses natural marble as the optical base, which the material describes as beneficial for improving laser output stability and overall machining precision during operation.

 

The laser source adopts water-circulation cooling. The document also notes that the core pump module uses a “USA CEO pump module” (wording as stated in the source) to support stable, long-duration operation.

 


Green Laser Diamond Cutting System 3System Configuration (Main Modules)

The system is described as an integrated platform including:

  • Laser system (532 nm output)

  • Optical path system

  • Software system (self-developed cutting software)

  • Control system (dedicated control card + programmable controller, with industrial PC)

  • Vision imaging system

  • Motion system (XYZ positioning/cutting execution)

Dust extraction: the machine provides only a dust-removal interface; the dust collector is not included.

 


 

Main Technical Specifications

Item Specification
Laser wavelength 532 nm 
Laser power 20 W @ 10 kHz 
Cooling method Water cooling 
Travel range X 150 mm; Y 150 mm; Z 70 mm 
Accuracy XYZ ±0.002 mm 
Repeatability XYZ ±0.001 mm 
Max stage speed 500 mm/s 
Control Googol motion control card; self-developed cutting software; industrial computer 
Vision 1.3 MP HD industrial camera 
Total power 2 kW 
Total weight Approx. 6800 kg 
Machine dimensions 990 (L) × 850 (W) × 1770 (H) mm 

 


Slicing / Cutting Reference Data (From the Material)

Slice size (mm) Max kerf width (μm) Cutting time (min) Top-to-bottom tolerance (μm)
7 × 7 230 20 30 
10 × 10 320 42 30 
15 × 15 600 160 30 

 

Interpretation (staying within the source information)
The examples show that as slice size increases, kerf width and cutting time increase accordingly, while the listed top-to-bottom tolerance remains 30 μm in the provided reference cases.

 

 


 

 

FAQ – Green Laser Diamond Cutting System 

What materials can it process?

According to the product material, typical applications include natural diamond, lab-grown diamond, and superhard materials such as CVD, PCD, MCD, and CBN.

 

Why does it use a 532 nm green laser?

The document states the 532 nm green laser is generated by frequency doubling of 1064 nm, and compared with 1064 nm (referred to as “red laser” in the material), it offers:

  • Higher processing efficiency

  • Smoother cut surface

  • Less graphitization

 

What are the key laser specifications?

  • Wavelength: 532 nm

  • Laser power: 20 W @ 10 kHz

  • Cooling: Water cooling