• Pico-precision Laser Drilling Machine for Sapphire bearing processing
  • Pico-precision Laser Drilling Machine for Sapphire bearing processing
  • Pico-precision Laser Drilling Machine for Sapphire bearing processing
  • Pico-precision Laser Drilling Machine for Sapphire bearing processing
Pico-precision Laser Drilling Machine for Sapphire bearing processing

Pico-precision Laser Drilling Machine for Sapphire bearing processing

Product Details:

Place of Origin: China
Brand Name: ZMSH

Payment & Shipping Terms:

Minimum Order Quantity: 1
Delivery Time: 6-8months
Payment Terms: T/T
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Detail Information

​Laser Type: Pico-fiber Laser Max Pulse Frequency: 100 KHz
Energy Range: 0.1–5 MJ Pulse Duration: <10^-12 Seconds
Average Power: Up To 20 KW Axes: 4-axis (X, Y, Z, C)
Positioning Accuracy: ±0.005mm Max Speed: 500 Mm/s (XYZ Axes)
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Sapphire bearing Laser Drilling Machine

Product Description

Product Overview

 

The equipment combines ultra-fast picosecond laser technology with intelligent control systems, designed for high-value material precision processing. Key advantages include:

  • ​Picosecond-level Ultra-fast Processing: 1064nm wavelength pulsed laser with energy levels adjustable from 0.1mJ to 5mJ (step size 0.1mJ), delivering pulse durations <10^-12 seconds. This minimizes thermal damage (<10μm heat-affected zone) and eliminates micro-cracking.
  • ​Full Digital Closed-loop Control: Equipped with industrial-grade PCs and proprietary ​LaserMaster Pro​ software, supporting G-code programming, CAD auto-conversion, and real-time path optimization. Positioning accuracy reaches ±0.005mm.
  • 4-Axis Intelligent System: XYZ axes with ±0.002mm repeatability and optional C-axis rotation enable complex multi-tasking for irregular hole patterns.

 

Typical Applications:

  • Semiconductor industry: Wafer drilling, micro-structure fabrication
  • Ultra-hard materials: Diamond tooling,apphire optical component micro-drilling
  • Biomedical field: Artificial joints, dental implants precision drilling
  • New energy sector: Lithium-ion battery micro-porous array processing

 

 


 

Technical Specifications

 

Category

Specifications Technical Highlights
Laser System Pico-fiber laser, peak power ≥20kW MOPA (Master Oscillator Power Amplifier) tech, pulse stability <3%
Motion Control​ 4-axis servo motors, ±0.002mm repeatability Grating scale feedback + adaptive damping algorithm, max speed 500mm/s
Vision System 150x zoom optics + black-and-white CCD camera 0.1μm resolution imaging, electronic crosshair alignment for pinpointing
​Energy Control​ Stepwise energy adjustment (0.1mJ increments) Optimized for varying material thicknesses
​Auxiliary Systems Dual-mode cooling (water/air), vacuum chuck Suitable for continuous operation and hazardous material processing

 

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Processing Performance & Quality Assurance

 

1. Exceptional Processing Capabilities

  • Micro-drilling: Minimum aperture φ0.5μm, depth-to-diameter ratio up to 1:50 (no chipping in hard materials)
  • Complex Structures: Supports conical holes (0.1°–5° adjustable), spiral grooves, and multi-stage holes in one process
  • Non-destructive Cutting: Ideal for thin films (e.g., PI film, graphene) with sub-micron precision

2. End-to-End Quality Management

  • Smart Compensation: Real-time monitoring of laser power fluctuations and thermal deformation with dynamic parameter adjustments
  • Process Database: Pre-built parameters for over 200 materials (metals, ceramics, gemstones, composites)
  • In-line Inspection: Automated generation of hole size distribution maps and surface roughness analysis reports (Ra ≤0.8μm)

3. Material Compatibility Test Results

Material Type Typical Processing Outcome
Polycrystalline Diamond (PCD) φ2μm holes with smooth edges/no burrs
18K Gold Sub-micron hollow patterns without oxidation
Tungsten Carbide (WC) Diameter tolerance ±1.5%, depth-to-diameter ratio 1:30
Bio-Glass Low thermal stress drilling, >95% cell viability

 



ZMSH Pico-precision Laser Drilling Machine

   

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FAQs

 

Q: Is the equipment commissioning time-consuming?

A: Pre-installed parameter packages enable 30-minute basic functional verification. Remote guidance by our team can further reduce setup time to ​2 hours.

 

Q: How to handle multi-material sequential cutting?

A: Supports multi-layer processing modes with automatic tool change and parameter switching between materials like stainless steel and ceramics.

 

​Q: What is the energy consumption?

A: Energy-efficient design (40% lower than conventional systems) with smart standby mode. Hourly operating cost ​<¥5.

 

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