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CNC Sapphire Surface Grinding Machine Precision Surface Grinder Polisher
Product Details:
| Brand Name: | ZMSH |
Payment & Shipping Terms:
| Minimum Order Quantity: | 1 |
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| Payment Terms: | T/T |
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Detail Information |
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| Equipment Area: | 2.62m (Length) × 1.7m (Width) × 1.9m (Height) | Equipment Weight: | 2 Tons |
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| Maximum Left-Right Travel: | 700mm | Maximum Front-Back Travel: | 350mm |
| Spindle Speed: | 1450 RPM (50Hz), 1740 RPM (60Hz) | Worktable Adjustment: | ±1–8mm |
| Highlight: | Precision Surface Grinder Polisher,Sapphire Surface Grinding Machine,CNC Sapphire Surface Grinding Machine |
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Product Description
Product Introduction
Key components are equipped with well-known brands, ensuring high stability and durability.
P3-grade precision ball screws are adopted for transmission, guaranteeing superior accuracy.
High-grade gray cast iron castings are utilized, offering excellent resistance to bending and torsional stress.Optional three-stage filtration tanks or paper belt filters are available to maintain cutting fluid cleanliness, enhance machining performance and tool longevity, and reduce environmental pollution.
Working Principle
During the operation of a sapphire grinding machine, the grinding wheel rotates at high speed to polish the surface of the sapphire workpiece. Contact between the grinding wheel and the sapphire surface removes excess material. During processing, key parameters such as grinding wheel rotation speed and feed rate must be precisely adjusted to ensure machining accuracy. Through mechanical grinding, this equipment meets the machining requirements for surface flatness and smoothness of sapphire materials.
Structural composition
A grinding machine consists of components such as the bed, worktable, grinding wheel head, and column.
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Bed: Serves as the foundation of the grinder, supporting the weight of all other components.
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Worktable: Designed to secure and move sapphire workpieces while enabling precise positional adjustments and controlled motion.
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Grinding Wheel Head: Equipped with a grinding wheel that rotates at high speeds to perform material removal.
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Column: Provides structural support and interconnects all components, ensuring stable operation and coordinated functionality to achieve the grinding process.
Specifications
| Item | Value |
|---|---|
| Equipment Area | 2.62m (Length) × 1.7m (Width) × 1.9m (Height) |
| Weight | 2.62m (Length) × 1.7m (Width) × 2.1m (Height) |
| Equipment Weight | 2 tons |
| Worktable Area | 600×300mm |
| Maximum Worktable Travel | 525mm (Standard) / 725mm (Elevated) |
| Maximum Left-Right Travel | 700mm |
| Maximum Front-Back Travel | 350mm |
| Worktable Speed | 5-25mm/min |
| Worktable Adjustment | ±1–8mm |
| Grinding Wheel Size | Ø355mm × Ø127mm × 20×40mm |
| Spindle Speed | 1450 RPM (50Hz), 1740 RPM (60Hz) |
| Linear Accuracy | ±0.01mm |
| Surface Flatness | ±0.01mm |
Performance Characteristics
The grinding machine exhibits extremely high precision, capable of achieving micron-level accuracy in sapphire surface processing, fully meeting the stringent requirements of high-end sapphire manufacturing.
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Rapid Grinding Efficiency: The machine operates at high-speed grinding, enabling efficient completion of bulk workpiece processing within short timeframes.
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Stable Operation: Equipped with vibration-damping technology, the machine ensures smooth and consistent performance. Minimal vibration during operation enhances processing stability, reduces reject rates, and guarantees product quality uniformity.
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Advanced Control: Precision adjustments for parameters like wheel speed and feed rate are seamlessly integrated, ensuri ng repeatable and reliable outcomes.
Application
Electronics Industry
The sapphire-specific surface grinder is used to process high-precision components such as camera lens covers. Its machining accuracy (e.g., surface roughness ≤0.2 μm) ensures superior optical performance and surface quality of sapphire, directly enhancing the reliability and longevity of electronic products.
Optical Industry
Ideal for precision machining of sapphire lenses and prisms, achieving roundness accuracy ≤0.003mm. This meets the stringent quality requirements of optical systems, ensuring stable performance and long-term consistency of instruments.
Q&A
Q1: What is the maximum size of sapphire workpieces this grinder can process?
A1: Grinding Diameter Range: Φ2" to 12" .
Q2: What are the core advantages of this sapphire-specific grinding machine?
A2:
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Ultra-High Precision: Achieves surface roughness ≤0.2 μm and roundness ≤0.003mm, meeting stringent standards for optical and electronic applications.
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High Efficiency: Operates at a wheel linear velocity of 35m/s and supports rapid processing of bulk workpieces.
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Stable Performance: Incorporates vibration-damping technology to minimize operational vibration, ensuring consistency and reducing reject rates.
Q3: How does the machine ensure consistent product quality?
A3:
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Precision Control: Adjustable parameters like wheel speed and feed rate (e.g., 0.005mm minimal worktable feeding) enable fine-tuned operations.
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Stability Design: Low-vibration operation and rigid structural components (e.g., high-grade cast iron bed) enhance machining consistency.
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