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Semi-insulating SiC-On-Si Composite Substrates 4H Exhibit High Resistivity LED

Semi-insulating SiC-On-Si Composite Substrates 4H Exhibit High Resistivity LED

Brand Name: ZMSH
Payment Terms: T/T
Detail Information
Place of Origin:
China
Substrate Material:
Silicon Carbide On Silicon Compound Wafer
Front Surface:
CMP Polished, Ra < 0.5 Nm (single Side Polished, SSP)
Secondary Flat Length:
18.0 +/- 2.0 Mm
Type:
Semi-type
Primary Flat Length:
32.5 +/- 2.5 Mm
Diameter:
100 Mm +/- 0.5 Mm
Carbon Content:
0.5 Ppm
Secondary Flat Orientation::
90 Deg From Primary Flat
Highlight:

LEDs SiC on Si Composite substrates

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SiC On Si Composite Substrates

Product Description

Semi-insulating SiC On Si Composite Substrates 4H Exhibit High Resistivity LED

Product Description of SiC On Si Composite Substrates:

A semi-insulating silicon carbide (SiC) on silicon compound wafer is a specialized type of wafer that combines the properties of silicon carbide and silicon materials. The wafer consists of a layer of semi-insulating silicon carbide on top of a silicon substrate. The term "semi-insulating" indicates that the material has electrical properties that are not purely conductive or purely insulating, but somewhere in between.

 

Character of SiC On Si Composite Substrates:

 

1. High Resistivity: Semi-insulating SiC on Si wafers exhibit high resistivity, which means they have low electrical conductivity compared to regular conductive materials.


2. Low Leakage: Due to their semi-insulating nature, these wafers have low leakage currents, making them suitable for applications requiring minimal electrical leakage.


3. High Breakdown Voltage: They typically have a high breakdown voltage, enabling them to withstand high electric fields without breakdown.

 

Parameter List​ of SiC On Si Composite Substrates:

Item Specification
Diameter 150 ± 0.2 mm
SiC Polytype 4H
SiC Resistivity ≥1E8 Ω·cm
Transfer SiC layer Thickness ≥0.1 μm
Void ≤5 ea/wafer (2 mm > D > 0.5 mm)
Front roughness Ra ≤ 0.2 nm (5 μm × 5 μm)
Si Orientation <111>/<100>/<110>
Si Type P/N
Flat/Notch Flat/Notch
Edge Chip, Scratch, Crack (visual inspection) None
TTV ≤5 μm
Thickness 500/625/675 ± 25 μm

 Applications of SiC On Si Composite Substrates:

1. High-Frequency Devices: Semi-insulating SiC on Si compound wafers are commonly used in high-frequency devices such as RF transistors, amplifiers, and microwave systems.


2. Power Electronics: They find applications in power electronic devices where high breakdown voltage and low electrical losses are crucial for efficient power conversion.


3. Sensors: These wafers are utilized in sensor technologies where high resistivity and low leakage characteristics are required for accurate sensing and measurement.


4. Optoelectronics: In optoelectronic devices like photodetectors and LEDs, semi-insulating SiC on Si wafers can provide improved performance due to their unique electrical properties.

 

Applications Picture of SiC On Si Composite Substrates:

 

Semi-insulating SiC-On-Si Composite Substrates 4H  Exhibit High Resistivity  LED 0

FAQ:

1.Q:What is SiC on Si wafers?
   A:These wafers are composed of a single crystal of SiC, a compound semiconductor material where silicon and carbon atoms form a strong, three-dimensional network.
2.Q:How is SiC compared to Si?
   A: A key differentiator of SiC over silicon is its higher system-level efficiency, owing to the greater power density, lower power loss, higher operating frequency, and increased temperature operation.
3. Q:Is SiC a composite?
    A: The use of silicon carbide composite (SiC/SiC) components within fusion reactors has the potential to double the electricity generated from every gigawatt of thermal energy produced compared with advanced steel designs