|Secondary Flat Length:
|18.0 +/- 2.0 Mm
|Thermal Expansion Coefficient:
|Primary Flat Length:
|32.5 +/- 2.5 Mm
|1.6 X 10^18 Atoms/cm3
|Secondary Flat Orientation::
|90 Deg From Primary Flat
Solar Cells Silicon Wafer,
High Purity Single Crystal Silicon Wafer
Silicon wafer Conductivity Solar Cells Solar Cells Power Semiconductor Devices High Purity
Single Crystal Silicon Wafer
Primary Flat Orientation
<110> +/-1 Deg
Secondary Flat Orientation
90 Deg From Primary Flat
100 Mm +/- 0.5 Mm
1.6 X 10^18 Atoms/cm3
Secondary Flat Length
18.0 +/- 2.0 Mm
Thermal Expansion Coefficient
A silicon wafer, commonly referred to as Si wafer, is a foundational material in the semiconductor industry, playing a pivotal role in the production of integrated circuits (ICs) and other semiconductor devices. Silicon, a semiconductor material, is chosen for its excellent electrical properties, making it ideal for constructing electronic components.
The manufacturing process of silicon wafers begins with the growth of a cylindrical ingot of crystalline silicon. This ingot is then sliced into thin, disk-shaped wafers using precision cutting techniques. The resulting wafers undergo a meticulous polishing process to achieve a smooth and flat surface, crucial for subsequent manufacturing steps.
One of the defining characteristics of silicon wafers is their single crystal structure. These wafers are typically composed of a single crystal of silicon, ensuring a consistent and well-defined crystal lattice throughout the material. This single-crystal structure contributes to the reliability and performance of semiconductor devices.
Silicon wafers come in various sizes, with diameters ranging from 100 to 300 millimeters. The choice of wafer size depends on industry standards and specific manufacturing requirements. Larger wafers enable higher production efficiency and cost-effectiveness.
The semiconductor fabrication process involves depositing different materials onto the silicon wafer, creating intricate patterns using photolithography, and etching to form transistors, diodes, and other electronic components. Silicon wafers serve as the substrate for these microelectronic structures, providing a stable foundation for the integration of complex circuits.
Si wafers find extensive applications in the production of microprocessors, memory devices, sensors, and various other electronic components. The continuous demand for smaller, more powerful semiconductor devices has driven advancements in silicon wafer manufacturing techniques.
In addition to their role in microelectronics, silicon wafers are crucial for the development of photovoltaic cells used in solar panels. The ability of silicon to convert sunlight into electricity makes it a key material for renewable energy applications.
In conclusion, silicon wafers are fundamental to the semiconductor industry, serving as the building blocks for the creation of integrated circuits and semiconductor devices. Their precise manufacturing and exceptional electrical properties contribute to the advancement of technology, enabling the production of innovative electronic products that power our modern world.
Silicon wafers, often denoted as Si wafers, stand as the bedrock of the semiconductor industry, embodying a myriad of characteristics that propel the manufacturing of advanced electronic devices. Silicon, a semiconductor material, is chosen for its unique properties, making it indispensable in the intricate processes of semiconductor fabrication.
A defining feature of silicon wafers is their single crystal structure. These wafers are meticulously crafted from a single crystal of silicon, ensuring a uniform and well-organized lattice structure throughout the material. This singular crystalline nature is critical for the reliability and performance of the semiconductor devices that are later constructed upon them.
The manufacturing journey of silicon wafers initiates with the cultivation of a cylindrical ingot of crystalline silicon. Precision cutting techniques are then employed to slice this ingot into thin, disk-shaped wafers. Subsequent to this, a sophisticated polishing process is executed to achieve a surface that is both smooth and flat. This level of precision is imperative for the success of subsequent manufacturing steps.
Si wafers are characterized by their diverse sizes, with common diameters ranging from 100 to 300 millimeters. The choice of wafer size is influenced by industry standards and specific manufacturing requisites. Larger wafers contribute to heightened production efficiency and cost-effectiveness.
The conductivity of silicon is another pivotal characteristic. As a semiconductor material, silicon's conductivity can be modulated through a process known as doping. This feature enables the tailoring of electrical properties for the production of various electronic components such as transistors, diodes, and integrated circuits.
Surface smoothness is a paramount attribute of silicon wafers. The meticulous polishing ensures that the surface is not only flat but also smooth, facilitating subsequent processes like photolithography that demand precision.
The coefficient of thermal expansion is carefully considered in silicon wafer production. Ensuring compatibility with other materials prevents stress and deformation during temperature fluctuations, contributing to the overall stability of the devices.
Chemical stability is inherent to silicon wafers, allowing them to withstand diverse chemical environments encountered during different semiconductor processes. This chemical resilience enhances their versatility in semiconductor manufacturing.
Beyond their role in microelectronics, silicon wafers find application in the field of photovoltaics. They serve as the foundation for solar cells, playing a pivotal role in harnessing solar energy and transforming it into electricity.
In conclusion, silicon wafers epitomize precision and versatility in the semiconductor realm. Their single crystal structure, tailored conductivity, and compatibility with various manufacturing processes make them indispensable for the creation of integrated circuits and semiconductor devices, contributing significantly to the technological landscape that defines the modern era.
Integrated Circuits (ICs): Si wafers are the foundational material for the production of integrated circuits, the core components of electronic devices.
Transistors: Si wafers are essential for manufacturing transistors, crucial electronic switches in semiconductor devices.
Diodes: Used as the substrate for diodes, Si wafers contribute to the creation of semiconductor devices with rectifying properties.
Microprocessors: Si wafers play a central role in the manufacturing of microprocessors, the processing units in computers and electronic devices.
Memory Devices: Si wafers are employed in the production of various memory devices, including RAM and flash memory.
Solar Cells: Si wafers serve as the base material for solar cells, converting sunlight into electrical energy.
Optoelectronic Devices: Si wafers contribute to the manufacturing of optoelectronic devices such as light-emitting diodes (LEDs) and photodetectors.
Sensors: Used in the fabrication of sensors for applications such as pressure, temperature, and motion sensing.
MEMS Devices: Si wafers are utilized in the production of Micro-Electro-Mechanical Systems (MEMS) devices, including accelerometers and gyroscopes.
Power Devices: Si wafers play a role in the manufacturing of power semiconductor devices used in power electronics and electrical systems.
Radio-Frequency (RF) Devices: Si wafers are employed in the creation of RF devices for wireless communication and signal processing.
Microcontrollers: Si wafers are integral to the manufacturing of microcontrollers, found in a variety of electronic systems.
Analog Circuits: Used for the fabrication of analog circuits for processing continuous signals in electronics.
Fiber Optic Components: Si wafers play a role in manufacturing components for fiber optic communication systems.
Biomedical Sensors: Utilized in the production of sensors for biomedical applications, including glucose sensors and DNA microarrays.
Smartphones: Si wafers contribute to the production of semiconductor chips used in smartphones for various functions.
Automotive Electronics: Si wafers are used in manufacturing semiconductor components for automotive electronics, including engine control units.
Consumer Electronics: Si wafers are incorporated into various consumer electronics such as TVs, cameras, and audio devices.
Wireless Communication Devices: Si wafers are essential for the production of chips used in wireless communication devices like routers and modems.
Digital Signal Processors (DSPs): Used in the manufacturing of DSPs, specialized microprocessors for digital signal processing applications.
Printed Circuit Boards (PCBs): Si wafers contribute to the creation of PCBs, the backbone of electronic circuits.
Electric Vehicles: Si wafers are employed in the production of semiconductor components for electric vehicle systems.
Instrumentation Devices: Used in the manufacturing of precision instrumentation devices for measurement and control.
Satellite Systems: Si wafers play a role in semiconductor components used in satellite communication and navigation systems.
Data Storage Devices: Si wafers are utilized in the fabrication of data storage devices such as hard drives and solid-state drives.
Power Management Circuits: Si wafers are crucial for power management circuits used in electronic systems.
Digital Cameras: Si wafers contribute to the production of semiconductor components in digital cameras.
Robotics: Used in the manufacturing of semiconductor components for robotics and automation systems.
Medical Imaging Devices: Si wafers play a role in semiconductor components used in medical imaging devices like X-ray machines.
Industrial Control Systems: Si wafers are employed in semiconductor components for industrial control and automation applications.
Brand Name: ZMSH
Model Number: Si wafer
Place of Origin: China
Thickness: 525 Um +/- 20 Um (SSP)
Carbon Content: 0.5 Ppm
Diameter: 100 Mm +/- 0.5 Mm
GBIR/ TTV: 5 µm
Conductivity: High conductivity for optimal performance
Semiconductor material: High grade silicon and other semiconductor materials for optimal performance
Surface oxidation: Highly accurate surface oxidation for precise control
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