6 Inch LiTaO3 LiNbO3 Wafer Black Polarized For SAW / BAW 128 Degrees Y Z-Cut
Product Details:
Place of Origin: | China |
Brand Name: | ZMKJ |
Certification: | ROHS |
Model Number: | JZ-4INCH-LNOI |
Payment & Shipping Terms:
Minimum Order Quantity: | 2pcs |
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Price: | by case |
Packaging Details: | single wafer container in cleaning room |
Delivery Time: | 4 weeks |
Payment Terms: | T/T, Western Union, paypal |
Supply Ability: | 10pcs/month |
Detail Information |
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Material: | LiNbO3 Layer On Silicon Substrate | Layer Thickness: | 300-1000nm |
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Orientation: | X-CUT | Application 2: | 5G Saw/BAW Devices |
Ra: | 0.5nm | Isolation Layer: | SiO2 |
Substrate: | 525um | Size: | 4inch 6inch 8inch |
Highlight: | 6 Inch LiNbO3 Wafer,BAW LiNbO3 Wafer,Z-Cut LiTaO3 Wafer |
Product Description
6 Inch LiTaO3 LiNbO3 Wafer Black Polarized For SAW / BAW Applications 128 Degrees Y Z-Cut
Lithium niobate (LiNbO3) single crystal is a ferroelectric crystal with high electromechanical coupling coefficient and low propagation loss, which can be used to fabricate SAW devices with up to 50% bandwidth. The acoustic surface wave properties of lithium niobate single crystal materials are closely related to their orientation and propagation direction. According to different cutting angles and propagation directions, the saw propagation velocity is 3400~4000m/s, the electromechanical coupling coefficient is 0%~5.6%, and the temperature coefficient is -1.1~-95.6(10^-6/℃).
Lithium tantalate (LiTaO3) has piezoelectric, electro-optical and nonlinear optical characteristics, and a wide transparency range going from ultraviolet to infrared. It is desirable that LiTaO3 wafer was a smooth surface in order to function with good quality. Chemical mechanical polishing (CMP) has been used to planarize integrated circuits (ICs) or obtain a high surface quality of the substrates. This paper investigates the effect of citric acid as an additive in the slurry for LiTaO3 CMP. The roughness of the wafers was measured by an atomic force microscopy (AFM, XE-100) after polishing. The slurry, which contains citric acid as an additive, has a higher material removal rate and friction force than a slurry without an additive. After polishing, the surface roughness of the LiTaO3 wafer can be reduced down to 1.7A of Ra.
Characteristic Specification
Crystal Sturucture | Trigonal, Space group R3c, Point group 3m |
Melting Point | 1253℃ |
Mohs Hardness | 5 |
Density (g/cm3) | 4.64 |
Deliquescence | None |
Optical Homogeneity | ~5x10-5/cm |
Transparency Range | 420-5200nm |
Absorption Coefficient | ~0.1%/cm @1064nm |
Refractive Indices | ne=2.146, no=2.220@1300nm |
Thermal Expansion Coefficients (at 25℃ ) | //a,2.0x10-6/K |
Thermal Conductivity Coefficients | 38 W/m/K at 25℃ |
Thermal Optical Coefficients | dno/dT=-0.874 x 10-6/K at 1.4μm |
The Sellmeier Equations | no2=4.9048+0.11768/(λ2-0.04750)-0.027169λ2 |
Material | 3" 4" 6" LT wafer Saw/Optical grade | ||
Orientation | X112°/Y28°/Y36°/Y42°/YZ or Customized | ||
Curie Temp | 605°C±3°C | ||
Doped with | Fe | ||
Single Domain | Completed Polarization / Reduced | ||
Orientation | 36°Y, 42°Y, X-112°Y, Y, Z | ||
Diameter | 76.2±0.2mm | 100±0.2mm | 150±0.2mm |
Primary Flat | 22±1mm | 32±1mm | 47.5mm, 57.5mm, Notch |
Thickness | 0.07mm~1.0mm | 0.1mm~1.0mm | 0.35mm~1.0mm |
Surface finish | Single / Double side polish / Double side lapped | ||
TTV | < 1~5µm | ||
BOW | ± (20µm ~40um ) | ||
Warp | <= 20µm ~ 50µm | ||
LTV (5mmx5mm) | <1.5 um | ||
PLTV(<0.5um) | ≥98% (5mm*5mm) with 2mm edge excluded | ||
Polished side Ra | Roughness Ra<=5A | ||
Back Side Criteria | Roughness Ra:0.5-1.0µm, GC#1000 | ||
Scratch & Dig (S/D) | 20/10, 40/20, 60/40 | ||
Edge Profile | Compl't with SEMI M1.2@with GC800# .regular at C typed | ||
Cracks, saw marks, stains | None |
Display of LiTaO3 Wafer and LiNbO3