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Multi-Wire Diamond Sawing System for SiC Sapphire Ultra-Hard Brittle Materials

Name: Multi-Wire Diamond Sawing System for SiC Sapphire Ultra-Hard Brittle Materials
Uploaded: 2025-08-20CDT11:09:23-05:00
Duration: 17 s
Description: Multi-Wire Diamond Sawing System for SiC Sapphire Ultra-Hard Brittle Materials, Find Complete Details about Multi-Wire Diamond Sawing System for SiC Sapphire Ultra-Hard Brittle Materials from SHANGHAI FAMOUS TRADE CO.,LTD Supplier or Manufacturer on sapphire-substrate.com

Scientific Lab Equipment

2025-08-20

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Multi-Wire Diamond Sawing Machine for SiC / Sapphire / Ultra-Hard Brittle Materials Overview of multi-wire diamond sawing machine The multi-wire diamond sawing machine is an advanced precision slicing ... View More

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Multi-Wire Diamond Sawing System for SiC Sapphire Ultra-Hard Brittle Materials

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