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Ti Cu Silicon Wafers Enhanced Conductivity

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January 09, 2026
Category Connection: Semiconductor Substrate
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Tags:
#semiconductor wafer #wafer substrate #gasb substrate
Brief: This video explains the main functions and practical uses of Ti/Cu Metal-Coated Silicon Wafers in a clear, step-by-step format. You will see how the titanium adhesion layer and copper conductive layer are deposited using magnetron sputtering, learn about the customizable specifications, and discover their applications in research and industrial prototyping.
Related Product Features:
  • Fabricated with a titanium adhesion layer for enhanced film adhesion and interfacial stability.
  • Copper conductive layer provides excellent electrical conductivity for various applications.
  • Deposited using standard magnetron sputtering for a stable and repeatable process.
  • Available in multiple wafer sizes, conductivity types, orientations, and resistivity ranges.
  • Supports full customization for size, substrate material, film stack, and thickness.
  • Suitable for ohmic contacts, electrodes, and seed layers for electroplating processes.
  • Ideal for nanomaterials, thin-film research, and microscopy applications.
  • Can be coated on single or double sides of the wafer upon request.
FAQs:
  • Why is a titanium layer used under the copper coating?
    Titanium acts as an adhesion layer, improving the attachment of copper to the substrate and enhancing interface stability, which helps reduce peeling or delamination during handling and processing.
  • What are the typical thickness configurations for the Ti and Cu layers?
    Common combinations include Ti layers of 10-50 nm and Cu layers of 50-300 nm for sputtered films. Thicker Cu layers at the micrometer level can be achieved by electroplating on a sputtered Cu seed layer, depending on the application requirements.
  • Can the wafer be coated on both sides?
    Yes, both single-side and double-side coating options are available upon request. Please specify your coating requirement when placing an order.
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