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TGV glass substrate, through-hole coating, semiconductor packaging

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May 06, 2025
Category Connection: Sapphire Substrate
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Tags:
#sapphire wafer #silicon substrate #sapphire material
Brief: Discover the advanced TGV glass substrate with through-hole coating for semiconductor packaging. Ideal for high-frequency communications, AI chips, and automotive applications, this technology offers superior electrical performance, cost efficiency, and mechanical stability. Learn how TGV glass substrates revolutionize chip interconnection and packaging.
Related Product Features:
  • TGV glass substrate enables high-density vertical electrical interconnections for chips.
  • Superior high-frequency electrical performance with minimal signal loss.
  • Cost-efficient large-scale ultra-thin glass substrate production.
  • Simplified process flow compared to traditional silicon substrates.
  • Strong mechanical stability with near-zero warpage even at ultra-thin thicknesses.
  • Broad application potential in 5G/6G, AI chips, automotive radar, and implantable devices.
  • Supports panel-level packaging (PLP) for mass production of advanced 3D ICs.
  • Optical transparency enables hybrid electrical/optical integration.
Faqs:
  • What is TGV glass?
    TGV glass is a glass substrate with vertical conductive vias for high-density chip interconnection, suitable for high-frequency and 3D packaging.
  • What is the difference between glass substrate and silicon substrate?
    Glass is an insulator with low dielectric loss, offering 10-100 times lower signal loss than silicon. It is also more cost-effective and has a simpler process flow compared to silicon substrates.
  • Why choose glass core substrates?
    Glass core substrates provide high-frequency superiority, cost efficiency, thermal and mechanical stability, optical transparency, and scalability for mass production of advanced 3D ICs.
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