8/6/4/2Inch LPCVD Oxidation Furnace Full Automation Low Oxygen Control Thin Film Deposition

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April 27, 2025
Category Connection: Scientific Lab Equipment
Brief: Discover the 8/6/4/2Inch LPCVD Oxidation Furnace, a fully automated system for thin film deposition with low oxygen control. Ideal for semiconductor manufacturing, it ensures excellent film uniformity and repeatability, supporting various oxidation, annealing, and LPCVD processes. Perfect for high-volume production with seamless MES integration.
Related Product Features:
  • Fully automated 8-inch vertical oxidation LPCVD furnace for mass production.
  • Excellent film uniformity and repeatability for high-quality results.
  • Supports various oxidation, annealing, and LPCVD processes.
  • Features 21-cassette automatic transfer for efficient wafer handling.
  • Seamless MES integration for smart factory operations.
  • Advanced low-oxygen micro-environment control for precise deposition.
  • Capable of depositing polysilicon, silicon nitride, and silicon dioxide films.
  • Supports 150 wafers per batch, ideal for high-volume production.
Faqs:
  • How many wafers can be processed per batch?
    The system supports 150 wafers per batch, making it suitable for high-volume production.
  • Does the system support multiple oxidation methods?
    Yes, it supports dry and wet oxidation, including DCE and HCL, to meet diverse process requirements.
  • Can the system interface with the factory MES?
    Yes, it supports SECS II/HSMS/GEM communication protocols for seamless MES integration and smart factory operations.