TGV glass
The formation of through hole vias is crucial for an interposer. TGV substrates are produced using a combination of laser and etching technology. The laser introduces structural modifications in the glass, making it weaker in predefined areas, which allows for faster etching rates in these modified regions compared to the surrounding material.
TGV
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Through Glass Vias (TGV) JGS1 JGS2 Sapphire BF33 Quartz Customizable Dimensions Thickness Can Low As 100 Μm
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Custom Polished Sapphire Substrate Fan Shaped High Temperature Resistance
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Polished Medicine Dia 200mm JGS2 JGS1 Quartz Tube
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