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TGV glass

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May 31, 2024
Category Connection: Sapphire Substrate
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Tags:
#sapphire wafer #silicon substrate #sapphire material
Brief: Discover the revolutionary Through-Glass Vias (TGV) technology, offering customizable dimensions and ultra-thin solutions down to 100 µm. Ideal for aerospace, military, medical, and consumer electronics, our TGV products use premium materials like JGS1, JGS2, sapphire, BF33, and quartz for unmatched performance and reliability.
Related Product Features:
  • Material Diversity: Crafted from high-quality materials including JGS1, JGS2, sapphire, BF33, and quartz for exceptional performance.
  • Customization: Fully customizable dimensions with thickness as low as 100 µm for ultra-thin applications.
  • Enhanced Performance: Superior materials improve thermal management and reduce signal losses for efficient operation.
  • Reliability and Durability: Engineered to withstand harsh conditions, suitable for aerospace, military, and medical devices.
  • Technological Superiority: Advanced TGV technology minimizes impedance and increases electronic device speed.
  • Market Flexibility: Versatile for applications from consumer electronics to specialized industrial equipment.
Faqs:
  • What materials are used in your TGV products?
    Our TGV products are crafted from high-quality materials including JGS1, JGS2, sapphire, BF33, and quartz, each chosen for their unique properties like optical clarity, thermal stability, and durability.
  • How thin can your TGV products be?
    Our TGV products can be customized to thicknesses as low as 100 µm, making them ideal for ultra-thin applications and enhancing device compactness.
  • What industries benefit from TGV technology?
    TGV technology is versatile and benefits industries such as aerospace, military, medical devices, consumer electronics, and industrial instrumentation due to its reliability, performance, and customization options.
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