| Brand Name: | ZMSH |
| MOQ: | 2 |
| Price: | 20USD |
| Packaging Details: | custom cartons |
| Payment Terms: | T/T |
We provide professional precision gold plating services for semiconductor packaging, optoelectronic components, precision electronics, RF devices, sensors, and customized metal parts.
Our service covers surface pretreatment, activation, nickel underplating, gold plating, cleaning, inspection, and quality control. Based on the substrate material, part geometry, plating area, and final application, we can provide customized plating solutions for prototypes, small batches, and mass production.
We support gold plating on various metal substrates, including:
A typical plating structure is:
Metal Substrate → Nickel Layer → Gold Layer
The nickel layer helps improve adhesion and acts as a diffusion barrier, while the gold layer provides excellent conductivity, corrosion resistance, oxidation resistance, solderability, and long-term surface stability.
![]()
![]()
Our gold plating service is widely used for:
For a quick evaluation and quotation, please provide:
If the plating thickness has not yet been determined, you may provide the application and technical requirements, and we can assist with process evaluation.
Common materials include Kovar, copper, copper alloys, nickel alloys, stainless steel, and other suitable metal substrates.
In many applications, yes. A nickel underlayer is commonly used to improve adhesion, provide a diffusion barrier, and enhance corrosion resistance. The exact plating structure depends on the substrate and application.
Yes. Both nickel and gold thickness can be customized according to customer drawings and technical requirements.
Yes. Both full-surface and selective gold plating can be evaluated depending on the geometry and masking requirements of the part.