Product Introduction

High precision laser drilling machine achieves the smallest focused laser spot through beam expansion and focusing and utilizes a control system to perform laser micromachining, laser drilling, and laser cutting. The complete system is equipped with one control computer, specialized software for laser drilling, and software for precision laser cutting. The software interface is user-friendly, allowing users to set parameters such as aperture size, drilling thickness and angle, drilling speed, and laser frequency. It features graphical display of drilling patterns, process tracking functionality, and supports G-code programming or automatic programming via CAD file input, making it easy to operate.

High precision laser drilling machine's main features include high drilling precision, minimal heat-affected zones, and powerful software functionality, which can meet the needs of laser micro-drilling for most materials. The system includes precision X, Y, and Z motion stages, which use precision ball screws and linear guides. The X and Y axes have a travel range of 50 mm, and the Z axis also has a travel range of 50 mm, with a repeatability of <±2 microns.

 

Operating Conditions:

• Suitable for operation in an environment with a temperature range of 18°C to 28°C and a relative humidity of 30% to 60%.
• Compatible with a power supply of 220V, 50Hz, 10A (single-phase).
• Equipped with a plug that complies with relevant Chinese standards. If such a plug is not available, an appropriate adapter must be provided.

High precision laser drilling machine is widely used in various industries for drilling applications, including diamond wire drawing dies, slow wire EDM dies, silencer micro-holes, needle micro-holes, gemstone bearings, nozzles, and more.

Materials Capable of Being Processed

This laser drilling machine is designed to process a wide range of hard and brittle materials with exceptional precision. Its advanced capabilities make it suitable for high-precision applications across various industries, including electronics, aerospace, medical devices, and more. The machine can handle materials that are traditionally difficult to process due to their hardness or brittleness.

 

1. Sapphire
   
   
   
   Sapphire, known for its hardness and optical clarity, is commonly used in high-end applications such as optical components, LED substrates, and watch crystals. The laser drilling machine can achieve micron-level precision in drilling sapphire, making it ideal for applications requiring extremely small and precise holes.
   
   
   
    

2. Ceramics
   
   
   
   Ceramics, including advanced materials like alumina, zirconia, and silicon carbide, are widely used in electronics, aerospace, and automotive industries due to their thermal and electrical insulating properties. The laser drilling machine is capable of drilling precise micro-holes in these tough materials without causing cracks or thermal damage, ensuring high-quality results.
   
    

3. Diamond
   
   
    
   As one of the hardest materials known to man, diamond is used in cutting tools, industrial abrasives, and high-performance optics. The laser drilling machine can process diamond with great accuracy, allowing for fine-tuned hole drilling in applications such as diamond tooling and gemstone processing.
   
   
    

4. Tungsten Carbide
   
   
   
   Tungsten carbide is widely used in manufacturing industrial tools, machine parts, and mining equipment due to its exceptional hardness and wear resistance. The laser drilling system can create precise holes in tungsten carbide, enhancing tool performance and durability.
   
   
   
   
    

5. Bio-glass
   
   
   
   Bio-glass materials, commonly used in medical applications such as bone implants, benefit from the machine's non-destructive drilling capabilities. The laser drilling machine ensures minimal thermal stress while maintaining the integrity of the material, making it ideal for medical and bioengineering applications.
   
    

6. Metals
   
   
   
   The laser system is also highly effective at processing various metals, including stainless steel, titanium, and gold. With the ability to control laser power and adjust processing parameters, the machine ensures that the metal’s surface is not compromised, and it delivers high-precision micro-holes.
    

Physical Structure

Applications

Ultra-Hard Material Processing

• Diamond Wire Drawing Dies: Micron-level hole drilling for enhanced wire accuracy.
• Gemstone Bearings/Nozzles: Crack-free drilling of brittle materials like ruby and sapphire.

High-Temperature-Resistant Material Processing

• Aerospace Components: Cooling holes in rhenium alloys and superalloys.
• Industrial Nozzles: High-density microhole arrays in stainless steel and carbon steel.

Precision Industrial Fields

• Medical Devices: Microholes in needles and drug atomization nozzles.
• Electronics: Through-holes and cutting in ceramic substrates and semiconductor materials.

Q&A

Q1: Can this machine process non-metallic materials (e.g., ceramics, polymers)?

A1: Yes. It handles ceramics, polycrystalline diamond, etc. Laser parameters (e.g., reduced power, shorter pulses) must be adjusted based on material thermal conductivity.

Q2: How to ensure accuracy in high aspect ratio (deep hole) machining?

A2: Uses Z-axis dynamic focusing + layered machining technology to remove material layer-by-layer and evacuate debris, preventing thermal buildup-induced deviations.

Q3: Does it support non-circular holes (e.g., tapered or square holes)?

A3: Yes. Built-in taper control algorithms adjust laser incidence angles and motion paths for complex geometries.

Q4: Are power and environmental conditions critical for operation?

A4: Requires stable 220V/50Hz power (voltage stabilizer recommended). Optimal environment: 18–28°C, 30–60% humidity to maintain optical stability.

Q5: How to minimize thermal damage during machining?

A5: Ultrafast pulses (picosecond/femtosecond) reduce heat diffusion. Software adjusts pulse intervals to enhance cooling.