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Microjet Laser Equipment High Precision Wafer Slicing AR Silicon Carbide Lens Processing
Product Details:
| Place of Origin: | China |
| Brand Name: | ZMSH |
Payment & Shipping Terms:
| Minimum Order Quantity: | 2 |
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| Payment Terms: | T/T |
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Detail Information |
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| Countertop Volume:: | 300*300*150 | Positioning Accuracy μm:: | +/-5 |
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| Repeated Positioning Accuracy μm:: | +/-2 | Numerical Control Type:: | DPSS Nd:YAG |
| Highlight: | AR silicon carbide lens processing,Microjet laser equipment,High Precision Microjet Laser Equipment |
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Product Description
Product Introduction
Microjet laser technology equipment is a combination of laser and high-speed water jet advanced processing technology, its core lies in the use of laser beam focus coupled to high-speed water jet, through the water jet guide laser accurately acting on the surface of the workpiece, so as to achieve efficient and high-precision processing effect. This technology has significant advantages in the field of hard and brittle material processing, and also shows a wide range of application potential in many fields such as semiconductors, aerospace, and medical devices.
Microjet laser technology equipment is mainly composed of laser system, light-water coupling system, high precision machine tool system, pure water/high pressure pump system, visual identification system and light-water electric machine tool control software system. Among them, the laser system adopts solid nanosecond laser with wavelength of 532/1064nm, and achieves high power output through frequency doubling technology. The optical water coupling system transmits the laser beam through the optical fiber and is coupled with the high-speed water jet to achieve the effect of cooling and guiding the laser beam.
Major advantage
The working principle of microjet laser technology is to focus the laser beam into the high-speed water jet, forming a total reflection effect, so that the laser energy is evenly distributed in the inner wall of the water column. When the laser beam reaches the surface of the workpiece, it is guided and cooled by the water jet to achieve precise cutting or machining. This process not only improves machining accuracy, but also effectively reduces material losses and heat-affected areas.
Specifications
| Countertop volume | 300*300*150 | 400*400*200 |
| Linear axis XY | Linear motor. Linear motor | Linear motor. Linear motor |
| Linear axis Z | 150 | 200 |
| Positioning accuracy μm | +/-5 | +/-5 |
| Repeated positioning accuracy μm | +/-2 | +/-2 |
| Acceleration G | 1 | 0.29 |
| Numerical control | 3 axis /3+1 axis /3+2 axis | 3 axis /3+1 axis /3+2 axis |
| Numerical control type | DPSS Nd:YAG | DPSS Nd:YAG |
| Wavelength nm | 532/1064 | 532/1064 |
| Rated power W | 50/100/200 | 50/100/200 |
| Water jet | 40-100 | 40-100 |
| Nozzle pressure bar | 50-100 | 50-600 |
| Dimensions (machine tool) (width * length * height) mm | 1445*1944*2260 | 1700*1500*2120 |
| Size (control cabinet) (W * L * H) | 700*2500*1600 | 700*2500*1600 |
| Weight (equipment) T | 2.5 | 3 |
| Weight (control cabinet) KG | 800 | 800 |
| Processing capability |
Surface roughness Ra≤1.6um Opening speed ≥1.25mm/s Circumference cutting ≥6mm/s Linear cutting speed ≥50mm/s |
Surface roughness Ra≤1.2um Opening speed ≥1.25mm/s Circumference cutting ≥6mm/s Linear cutting speed ≥50mm/s |
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For gallium nitride crystal, ultra-wide band gap semiconductor materials (diamond/Gallium oxide), aerospace special materials, LTCC carbon ceramic substrate, photovoltaic, scintillator crystal and other materials processing. Note: Processing capacity varies depending on material characteristics |
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Applications
Third generation semiconductor and aerospace materials processing: used for precision processing of third generation semiconductor materials such as silicon carbide and gallium nitride, as well as complex parts processing of materials such as superalloys and ceramic substrates in the aerospace field.
Medical device parts processing: suitable for high-precision cutting and processing of cardiovascular stents, implants, surgical tools and other medical instruments.
Ingot cutting: Used for efficient cutting of semiconductor materials such as silicon wafers and silicon carbide ingot.
Hard and brittle materials processing: including diamond, silicon nitride and other materials of complex parts processing.
ZMSH service
Customized solutions: Provide personalized equipment design and process optimization according to customer needs.
Technical support and training: Provide equipment operation training and technical support for customers to ensure that customers can use the equipment efficiently.
After-sales service: Provide long-term technical maintenance and spare parts supply service to ensure the stable operation of equipment.
R&d cooperation: Jointly develop new technologies or new processes with customers to promote industrial upgrading.