6 Inch / 8 Inch POD / FOSB Fiber Optic Splice Box Delivery Box Storage Box RSP Remote Service Platform FOUP Front Opening Unified Pod

6 inch POD /8 inch POD /FOSB(Fiber Optic Splice Box) /Delivery box/ Storage Box /RSP(Remote Service Platform) /FOUP(Front Opening Unified Pod)

PRODUCT FEATURES

6inch POD

Complies with SEMI standards

Available in standard and crane models

Compatible with 8-inch SMIF mechanical interface, matches 6-inch & 6.3-inch cassettes online

Optimized handle structure with anti-drop design

Multiple color options available for process management

Customized 6-inch compound semiconductor POD solutions

Transparent or orange box options available

8inch POD

Complies with SEMI standards

Available in standard and crane models

Numerous practical application cases

Transparent or orange box options available

Customization options supported

Multiple color options available for process management

Several proprietary improvements significantly enhance product reliability

FOSB(Fiber Optic Splice Box)

Complies with SEMI standards

Provides a clean environment for wafer transportation

Capacity: 25 PCS

Highly compatible, suitable for various equipment

Made from ultra-clean materials

Delivery box

Designed for 8-inch wafer shipment

Wide product range covering common types of shipping boxes

Extensive application examples in FABs

Storage Box

Suitable for the transfer and storage of 6-inch and 8-inch manual line cassettes

Ergonomic handle design on both sides for efficient handling

Optional transparent top cover

Extensive application examples in FABs

RSP(Remote Service Platform)

Compliant with SEMI standards

Supports both N2-purge and non-purge configurations

Superior airtight performance

Multiple patented designs

Extensive application references

FOUP(Front Opening Unified Pod)

Compliant with SEMI standards

Available in PC and water-resistant materials

Capacity options: 25 pcs or 13 pcs

Supports bulk delivery

Features multiple patented designs

Excellent inflation and airtight performance

Compatibility design enables mixed use with other brands

Multifunctional options to support diverse application scenarios

Q and A

Q:What is POD (Process Open/Close Device)?

A:POD (Process Open/Close Device) is a specialized container used in semiconductor manufacturing and microfabrication processes to safely store and transport wafers (typically silicon or sapphire) between different stages of production in a cleanroom environment. It is designed to protect wafers from contamination by airborne particles, humidity, or chemical exposure during automated handling processes.

POD Structure and Components

A POD typically consists of the following parts:

1.Lid – Provides a sealed cover to ensure the wafers are protected from external contaminants.

2.Base – Holds the wafers in place, with guides or slots to keep them securely positioned during transport.

3.Locking Mechanism – Ensures that the POD remains airtight when closed to prevent contamination.

Key Functions of POD

1.Contamination Prevention: The sealed design prevents wafers from being exposed to airborne particles, moisture, and chemicals.

2.Wafer Protection: Ensures that wafers are not physically damaged during transport and handling.

3.Automation Compatibility: PODs are compatible with Automatic Material Handling Systems (AMHS) used in semiconductor fabs to facilitate automated wafer loading and unloading.

4.Chemical Resistance: Made from high-performance polymers like PEEK, PFA, or polycarbonate, ensuring durability against corrosive chemicals used in semiconductor processes.

Applications of POD

PODs are widely used in the following areas:

1.Semiconductor wafer fabrication (silicon, sapphire, glass wafers)

2.MEMS (Micro-Electro-Mechanical Systems) manufacturing

3.Optical device production

4.Research and development laboratories

Advantages of Using POD

1.High sealing performance to maintain a particle-free environment

2.Stackable design to optimize cleanroom storage space

3.Robust construction to protect wafers from mechanical shock

4.Lightweight materials for ease of handling

5.Optional transparent window for visual inspection of the wafers inside

Future Trends in POD Development

With increasing demand for larger wafer sizes and higher cleanliness requirements, POD designs are evolving to meet automation, modularity, and multi-size compatibility needs. Future PODs are expected to feature smart monitoring systems and real-time contamination detection to further improve wafer protection and production efficiency.

Tag:#6 inch POD  #8 inch POD  #FOSB(Fiber Optic Splice Box)  #Delivery box # Storage Box  #RSP(Remote Service Platform)  #FOUP(Front Opening Unified Pod)