6 Inch 350um 0.5mmt Sapphire Carrier Substrate Wafer SSP DSP

Product Description

6 Inch 153mm 156mm 159mm Thickness 350um 0.5mmt Sapphire Carrier Substrate Wafer SSP DSP

Product Description:

Sapphire bonding sheet is used for thinning and polishing of gallium arsenide wafers Due to the weight and pressure imposed by the equipment, the traditional gallium arsenide wafer thinning process is liable to cause wafer fragmentation, or the surface stress accumulates to form a coil during the thinning process, and the product performance is seriously lost. The metal disk used for thinning is liable to produce metal pollution, and the wafer adhesive and chemical grinding fluid are liable to introduce pollution.

The new thinning process uses sapphire wafer (diameter slightly larger than the target wafer) as a carrier to bond with gallium arsenide wafer under high-temperature conditions. The gallium arsenide/sapphire bonding wafer is attached to a ceramic disk, thined and polished by a special fixture, and then melted in a high-temperature wash to separate the sapphire and gallium arsenide wafer.

The new thinning process can be used for the thinning processing of gallium arsenide and various semiconductor wafers, and the carrier material can be sapphire, glass and other polished wafers.

Sapphire is the mainstream carrier choice because of its superior physical and chemical properties and crystal structure. The sapphire carrier launched by our company matches the industry standard thinning equipment requirements with a diameter of 104mm for 4 inches. The 6-inch wafer has a diameter of 156mm or 159mm, slightly larger than the standard 4-inch, 6-inch wafer, and the polishing surface roughness.

Product specification

Material: > 99.99% high purity alumina crystal (bubble method)

Crystal direction: C plane (0001)

Diameter:

76.2mm (3-inch slide size variable)

104mm (4-inch slide size variable)

159mm (6-inch slide size variable)

Thickness: Custom

Polishing: double-sided polishing

CMP polishing surface roughness: Ra Total thickness tolerance TTV

Applications:

Sapphire Wafer from ZMSH: Crystal Clear Quality from China

Are you looking for high-quality sapphire wafers from China? Look no further than ZMSH's Sapphire Substrate! Our sapphire wafers are available in 2-inch, 4-inch, and 6-inch sizes, and feature single-side polished surfaces with a flatness of λ/10@633nm. With thicknesses ranging from 0.5mm to 2mm and parallelism of 3 arc seconds, our sapphire wafers offer crystal clear quality and maximum performance. Get the best of dependable sapphire wafers from ZMSH's Sapphire Substrate!

 

Technical Parameters:

Product Attributes	Technical Specifications
Material	Al2O3 99.999%
Clear Aperture	>90%
Surface Quality	Single Side Polished
Substrate Type	Single Crystal
Size	2inch 3inch 4inch 6inch 8inch 12inch
Surface Roughness	Ra<0.5nm
Surface Orientation	±0.5°
Parallelism	3 Arc Sec
Thickness	0.5-2mm
Perpendicularity	3 Arc Sec

 

Customization:

Introducing the ZMSH Sapphire Substrate, the perfect choice for your C-plane M-plane applications. Our Sapphire substrate is manufactured in China with superior TTV of <5μm and ±0.5° Surface Orientation. The Clear Aperture is >90%, and Perpendicularity is 3 Arc Sec. With a thickness of 0.5-2mm, this substrate is the perfect choice for your C-plane M-plane needs. Get your ZMSH Sapphire Substrate today.

Packing and Shipping:

Sapphire Substrate Packaging and Shipping

Sapphire substrate products are securely packaged with a protective bubble wrap, foam, and corrugated cardboard box to ensure safe and efficient delivery. All packages are shipped via a reliable, trackable courier service to guarantee timely and undamaged delivery.

For international orders, all shipments must pass international customs and may be subject to additional fees or taxes. Customers are responsible for any applicable customs, duties, or taxes.