2INCH 3INCH 4Inch Undoped Gallium Arsenide Wafer Semi Insulating GaAs Substrate For LED

 Growth Method

VGF

Dopant

p-type: Zn

n-type: Si

Wafer Shape

Round (dia: 2", 3", 4", 6")

Surface Orientation *

(100)±0.5°

* Other Orientations maybe available upon request

Dopant

Si (n-type)

Zn (p-type)

Carrier Concentration (cm-3)

( 0.8-4) × 1018

( 0.5-5) × 1019

Mobility (cm2/V.S.)

( 1-2.5) × 103

50-120

Etch Pitch Density (cm2)

100-5000

3,000-5,000

Wafer Diameter (mm)

50.8±0.3

76.2±0.3

100±0.3

Thickness (µm)

350±25

625±25

625±25

TTV [P/P] (µm)

≤ 4

≤ 4

≤ 4

TTV [P/E] (µm)

≤ 10

≤ 10

≤ 10

WARP (µm)

≤ 10

≤ 10

≤ 10

OF (mm)

17±1

22±1

32.5±1

OF / IF (mm)

7±1

12±1

18±1

Polish*

E/E,
P/E,
P/P

E/E,
P/E,
P/P

E/E,
P/E,
P/P

Growth Method

VGF

Dopant

SI Type: Carbon

Wafer Shape

Round (DIA: 2", 3", 4", 6")

Surface Orientation *

(100)±0.5°

* Other Orientations maybe available upon request

Resistivity (Ω.cm)

≥ 1 × 107

≥ 1 × 108

Mobility (cm2/V.S)

≥ 5,000

≥ 4,000

Etch Pitch Density (cm2)

1,500-5,000

1,500-5,000

Wafer Diameter (mm)

50.8±0.3

76.2±0.3

100±0.3

150±0.3

Thickness (µm)

350±25

625±25

625±25

675±25

TTV [P/P] (µm)

≤ 4

≤ 4

≤ 4

≤ 4

TTV [P/E] (µm)

≤ 10

≤ 10

≤ 10

≤ 10

WARP (µm)

≤ 10

≤ 10

≤ 10

≤ 15

OF (mm)

17±1

22±1

32.5±1

NOTCH

OF / IF (mm)

7±1

12±1

18±1

N/A

Polish*

E/E,
P/E,
P/P

E/E,
P/E,
P/P

E/E,
P/E,
P/P

E/E,
P/E,
P/P