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Ion Beam Polishing Machine for SiC Sapphire Quartz YAG

Ion Beam Polishing Machine for SiC Sapphire Quartz YAG

Brand Name: ZMSH
MOQ: 1
Price: by case
Packaging Details: custom cartons
Payment Terms: T/T
Detail Information
Place of Origin:
China
Processing Method:
Ion Sputtering Material Removal Under Vacuum
Processing Type:
Non-contact Surface Figuring & Polishing
Available Materials:
Quartz, Microcrystalline Glass, K9, Sapphire, YAG, Silicon Carbide, Single-crystal Silicon Carbide, Silicon, Germanium, Aluminum, Stainless Steel, Titanium Alloy, Etc.
Max Workpiece Size:
Φ4000 Mm
Motion Axes:
3-axis / 5-axis
Removal Stability:
≥95%
Supply Ability:
By case
Highlight:

SiC sapphire ion beam polisher

,

ion beam polishing machine for semiconductors

,

scientific lab equipment with ion beam

Product Description

Ion Beam Polishing Machine
Atomic-Level Precision · Non-Contact Processing · Ultra-Smooth Surfaces

 


Product Overview of Ion Beam Polishing Machine
 

The CNC Ion Beam Figuring/Polishing Machine operates on the principle of ion sputtering. Under vacuum conditions, the ion source generates a plasma beam, which is accelerated into an ion beam that bombards the workpiece surface for atomic-level material removal, enabling ultra-precise fabrication of optical components.


This technology offers non-contact processing, free from mechanical stress or subsurface damage, and is ideal for high-precision optics in astronomy, aerospace, semiconductors, and scientific research.

 

Ion Beam Polishing Machine for SiC Sapphire Quartz YAG 0    Ion Beam Polishing Machine for SiC Sapphire Quartz YAG 1

 


Working Principle of Ion Beam Polishing Machine

  • Ion Generation – Inert gas (e.g., argon) is introduced into the vacuum chamber and ionized by an electric discharge field.

 

  • Ion Acceleration & Beam Formation – Ions are accelerated to hundreds or thousands of electron volts (eV) and shaped into a stable beam spot by focusing optics.

 

  • Material Removal – The ion beam physically sputters surface atoms without chemical reactions.

 

  • Error Measurement & Path Planning – Surface figure errors are measured via interferometry, then removal functions are used to calculate beam dwell times and generate processing paths.

 

  • Closed-Loop Correction – Processing and measurement cycles are repeated until RMS/PV targets are achieved.

 Ion Beam Polishing Machine for SiC Sapphire Quartz YAG 2

 

 


Equipment Features of Ion Beam Polishing Machine

  • Non-contact processing – Capable of handling all surface shapes

  • Stable removal rate – Sub-nanometer figure correction accuracy

  • No subsurface damage – Preserves optical integrity

  • High consistency – Minimal fluctuation across materials of varying hardness

  • Low/Medium frequency correction – No mid-high frequency error generation

  • Low maintenance cost – Long-term continuous operation with minimal downtime

 


Equipment Processing Capacity of Ion Beam Polishing Machine

Available Surfaces:

  • Simple Optical Components: Plane, sphere, prism

  • Complex Optical Components: Symmetric/asymmetric asphere, off-axis asphere, cylindrical surface

  • Special Optical Components: Ultra-thin optics, slat optics, hemispherical optics, conformal optics, phase plates, freeform surfaces, other custom shapes

Available Materials:

  • Common optical glass: Quartz, Microcrystalline, K9, etc.

  • Infrared optics: Silicon, Germanium, etc.

  • Metals: Aluminum, Stainless Steel, Titanium Alloy, etc.

  • Crystal materials: YAG, Single-crystal Silicon Carbide, etc.

  • Other hard/brittle materials: Silicon Carbide, etc.

Surface Quality / Accuracy:

  • PV < 10 nm

  • RMS ≤ 0.5 nm

 


Product Advantages of Ion Beam Polishing Machine

  • Atomic-level removal precision – Enables ultra-smooth surfaces for demanding optical systems

  • Versatile shape compatibility – From flat optics to complex freeforms

  • Broad material adaptability – From precision crystals to hard ceramics and metals

  • Large aperture capability – Processes optics up to Φ4000 mm

  • Extended stable operation – Runs 3–5 weeks without vacuum chamber maintenance

 


Typical Models of Ion Beam Polishing Machine

  • IBF350 / IBF750 / IBF1000 / IBF1600 / IBF2000 / IBF4000

  • Motion Axes: 3-axis / 5-axis

  • Max Workpiece Size: up to Φ4000 mm

 

Item Specification
Processing Method Ion sputtering material removal under vacuum
Processing Type Non-contact surface figuring & polishing
Available Surfaces Plane, sphere, prism, asphere, off-axis asphere, cylindrical surface, freeform surface
Available Materials Quartz, microcrystalline glass, K9, sapphire, YAG, silicon carbide, single-crystal silicon carbide, silicon, germanium, aluminum, stainless steel, titanium alloy, etc.
Max Workpiece Size Φ4000 mm
Motion Axes 3-axis / 5-axis
Removal Stability ≥95%
Surface Accuracy PV < 10 nm; RMS ≤ 0.5 nm (typical RMS < 1 nm; PV < 15 nm)
Processing Capability Corrects low–medium frequency errors without introducing mid-high frequency errors
Continuous Operation 3–5 weeks without vacuum chamber maintenance
Maintenance Cost Low
Typical Models IBF350 / IBF750 / IBF1000 / IBF1600 / IBF2000 / IBF4000

 


 

Case 1 – Standard Flat Mirror

  • Workpiece: D630 mm Quartz flat

  • Result: PV 46.4 nm; RMS 4.63 nm

​​Ion Beam Polishing Machine for SiC Sapphire Quartz YAG 3

Case 2 – X-ray Reflective Mirror

 

  • Workpiece: 150 × 30 mm Silicon flat

  • Result: PV 8.3 nm; RMS 0.379 nm; Slope 0.13 µrad

Ion Beam Polishing Machine for SiC Sapphire Quartz YAG 4

Case 3 – Off-Axis Mirror

  • Workpiece: D326 mm Off-axis ground mirror

  • Result: PV 35.9 nm; RMS 3.9 nm

Ion Beam Polishing Machine for SiC Sapphire Quartz YAG 5


Application Fields of Ion Beam Polishing Machine

  • Astronomical optics – Large telescope primary/secondary mirrors

  • Space optics – Satellite remote sensing, deep-space imaging

  • High-power laser systems – ICF optics, beam shaping

  • Semiconductor optics – Lithography lenses & mirrors

  • Scientific instrumentation – X-ray/neutron mirrors, metrology standard components