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Glass Laser Drilling Machine Sapphire Processing Wavelength 532nm High Precision

Glass Laser Drilling Machine Sapphire Processing Wavelength 532nm High Precision

Brand Name: ZMSH
MOQ: 1
Payment Terms: T/T
Detail Information
Place of Origin:
China
Wavelength:
532nm
Laser Power:
15W/30W
Accuracy:
≤±0.015mm
Polishing:
≤±0.1mm
Processing Area​:
900mm × 600mm
Max Glass Size:
300mm × 300mm
Highlight:

High Precision Glass laser drilling machine

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Sapphire Processing Glass laser drilling machine

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532nm Glass laser drilling machine

Product Description

 

Laser Drilling Machine: Precision Engineering for Glass Processing​

 

The ​laser drilling machine are innovative solutions designed to revolutionize glass processing across industries. Engineered with a ​​customized 532nm green laser​​, these systems deliver unparalleled precision, minimal thermal damage, and exceptional stability. Ideal for display glass, quartz, and semiconductor wafers, we ensures ​​non-contact processing​​ with crack rates as low as ​​0.1%​​, making it the gold standard for high-precision applications.

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Key Features​​:

  • ​​Custom Green Laser Technology​​: Optimized for glass drilling with minimal heat-affected zones (HAZ).
  • ​​Dual Power Options​​: 15W/30W adjustable laser power for versatility in material thickness.
  • ​​User-Friendly Operation​​: Intuitive interface with a color touchscreen and programmable controls.
  • ​​High Material Utilization​​: Flexible cutting paths maximize yield and reduce waste.

 

 

Technical Specifications & Differentiators

 

Component

​Parameter​
Wavelength​ 532nm (Green Laser)
​Max Laser Power​ 15W/30W
Max Glass Size​ 300mm × 300mm
Processing Area​ 900mm × 600mm
Accuracy​ ≤±0.015mm

 

 

Performance & Quality of Laser Drilling Machine 

  1. ​Unmatched Precision​​:

    • Achieves ​​±0.015mm accuracy​​, ideal for micro-hole arrays in MEMS sensors and smartphone cameras.
    • ​Edge roughness (Ra)​​ ≤0.5μm ensures smooth, burr-free finishes.
  2. ​Stability & Efficiency​​:

    • ​8-hour continuous operation​​ with 99.8% yield, supported by dual cooling systems (air + water).
    • Automated focus adjustment eliminates manual intervention.
  3. ​Minimal Thermal Damage​​:

    • Green laser wavelength reduces heat diffusion, preventing micro-cracks and material deformation.

 

Applications

Glass Laser Drilling Machine Sapphire Processing Wavelength 532nm High Precision 0Glass Laser Drilling Machine Sapphire Processing Wavelength 532nm High Precision 1

 

ZMSH Glass Laser Drilling Machine

Glass Laser Drilling Machine Sapphire Processing Wavelength 532nm High Precision 2        Glass Laser Drilling Machine Sapphire Processing Wavelength 532nm High Precision 3

 

 

 

Frequently Asked Questions (FAQ)

 

Q: What material compatibility is supported beyond glass?​​
A: Besides standard soda-lime glass, the system processes ​​quartz​​, ​​borosilicate glass​​, and ​​semiconductor-grade silicon wafers​​ (with thermal conductivity ≤150 W/m·K). The green laser’s 532nm wavelength ensures absorption efficiency across these materials without requiring coating or pretreatment.

 

Q: How is dimensional accuracy maintained for large-format glass (900×600mm)?​​
A: Equipped with a ​​linear motor-driven Z-axis​​ and real-time collimation feedback, the system compensates for thermal drift and mechanical vibration. A patented ​​dynamic focal length adjustment​​ maintains ±0.015mm accuracy even at the edges of large plates.

 

Q: What environmental controls are required for optimal performance?​​
A: The device operates in ambient temperatures of ​​20±5°C​​ with relative humidity ≤60%. For extreme environments, optional ​​temperature-stabilized enclosures​​ (+/-0.5°C) and dustproofing kits are available to prevent laser beam distortion.

 

 

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