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Double-Sided Precision Grinding Machine – Metals Ceramics Plastics Glass

Double-Sided Precision Grinding Machine – Metals Ceramics Plastics Glass

Brand Name: ZMSH
MOQ: 1
Price: by case
Packaging Details: custom cartons
Payment Terms: T/T
Detail Information
Place of Origin:
China
Plate Size:
φ700×50 Mm
Item Parameter Item Parameter Plate Size φ700×50 Mm Max. Pressure 1000 Kgf Carrier Size:
φ238 Mm
Carrier Quantity:
6
Max. Workpiece Thickness:
75 Mm
Max. Workpiece Diameter:
φ180 Mm
Main Cylinder Stroke:
150 Mm
Supply Ability:
By case
Product Description

 

Overview of Double Sided Precision Grinding Machine

The double-sided precision grinding machine is a high-efficiency solution tailored for simultaneous grinding of both surfaces of workpieces. It is applicable to metallic materials (stainless steel,Double-Sided Precision Grinding Machine – Metals  Ceramics  Plastics  Glass 0 aluminum alloys, titanium alloys) as well as non-metals (ceramics, engineering plastics, optical glass). By processing upper and lower surfaces at the same time, the system guarantees exceptional parallelism (≤0.002 mm) and ultra-smooth finishes (Ra ≤0.1 μm). This makes it an essential piece of equipment for industries such as automotive parts, semiconductor packaging, precision bearings, and optical devices.

 

Compared with conventional single-sided grinders, the double-sided design drastically improves productivity through dual-wheel action while reducing alignment errors during clamping. Combined with modular automation functions (auto loading/unloading, closed-loop pressure control, in-line thickness inspection), it fully meets the needs of modern smart and mass production lines.

 

 


 

Technical Specifications Double Sided Precision Grinding Machine

Item Parameter Item Parameter
Plate size φ700×50 mm Max. pressure 1000 kgf
Carrier size φ238 mm Upper plate speed ≤160 rpm
Carrier quantity 6 Lower plate speed ≤160 rpm
Max. workpiece thickness 75 mm Sun wheel speed ≤85 rpm
Max. workpiece diameter φ180 mm Swing arm angle 55°
Main cylinder stroke 150 mm Total power 18.75 kW
Capacity (φ50 mm) 42 pcs Power cable spec 3×16+2×10 mm²
Capacity (φ100 mm) 12 pcs Air supply ≥0.4 MPa
Machine dimensions 2200×2160×2600 mm Weight 6000 kg

 

 


 

Operating Principle of Double Sided Precision Grinding Machine

  1. Dual-Wheel Grinding Mechanism

    • Two precision grinding wheels (diamond/CBN) rotate in opposite directions.

    • Workpieces are moved in planetary carriers for simultaneous double-surface grinding.

    • Grinding pressure (0.1–1.0 MPa) is finely controlled via servo or hydraulic systems.

  2. Positioning & Feeding

    • High-precision linear guides and servo drives ensure ±0.001 mm accuracy.

    • Optical or laser thickness gauges allow in-process monitoring and automatic correction.

  3. Cooling & Filtration

    • High-pressure coolant reduces heat deformation and flushes away chips.

    • Equipped with magnetic + centrifugal filtration for coolant recycling and wheel protection.

  4. Smart Control System

    • Siemens/Mitsubishi PLC with 10" HMI provides parameter storage, fault diagnosis, and remote control.

    • Adaptive algorithms automatically adjust grinding force, speed, and feed according to material hardness.

 

 


 

Key Features of Double Sided Precision Grinding Machine

  1. Rigid Machine Frame

    • Cast iron structure with aging treatment, excellent vibration damping.

    • Precision-grade bearings and preloaded ball screws achieve ≤0.003 mm repeatability.

  2. Intelligent Operation

    • PLC & inverter system with <1 ms response.

    • Multilingual HMI with recipe management and real-time process display.

  3. Flexible, Modular Design

    • Compatible with robotic arms and conveyors for unmanned operation.

    • Supports multiple wheel types (diamond, CBN, resin bond) to handle metals, ceramics, composites.

  4. High Precision & Versatility

    • Closed-loop pressure control (±1% accuracy).

    • Custom fixtures for irregular shapes (e.g., turbine blade roots, sealing rings).

 


 

Application Fields of Double Sided Precision Grinding Machine

  • Automotive:
    Crankshaft ends, piston rings, and gears requiring ≤0.005 mm parallelism and Ra ≤0.2 μm.

  • Semiconductor & Electronics:
    Ceramic substrates ground to ±0.001 mm; silicon wafer thinning for 3D IC packaging.

  • Precision Machinery:
    Bearings, shims, hydraulic blocks with ±0.002 mm tolerances.

  • Optics & Consumer Electronics:
    Smartphone glass finishing (Ra ≤0.05 μm); sapphire camera lenses with minimal stress deformation.

  • Aerospace:
    Superalloy turbine blade tenons and lightweight ceramic components for satellites.