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Through-Glass Vias (TGV) glass

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May 31, 2024
Keyword: Sapphire Substrate
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Tags:
#sapphire wafer #silicon substrate #sapphire material
Video Description:
Discover the innovative Through-Glass Vias (TGV) technology for JGS1, JGS2, sapphire, and Corning glass, designed for sensor manufacturing and packaging. Enhance performance and reliability in automotive, aerospace, medical, and consumer electronics with our advanced TGV solutions.
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