Brief: Discover the innovative Through-Glass Vias (TGV) technology for JGS1, JGS2, sapphire, and Corning glass, designed for sensor manufacturing and packaging. Enhance performance and reliability in automotive, aerospace, medical, and consumer electronics with our advanced TGV solutions.
Related Product Features:
Enables device miniaturization with compact interconnect solutions.
Supports anodic bonding with silicon wafers, eliminating out-gassing issues.
Superior high-frequency characteristics ideal for RF applications.
Precise via pitch tolerance of less than ±20μm per 200mm wafer.
Adaptable for wafers up to 200mm in diameter.
Laser-induced etching ensures crack-free blind and through vias.
High aspect ratios and high-density vias for modern technology demands.
Widely used in high-performance computing, 5G, IoT, and sensor packaging.
Faqs:
What is Through Glass Via (TGV) technology?
TGV technology is a microfabrication technique for creating vertical electrical connections through glass substrates, essential for advanced electronic packaging and high-density integration.
What are the applications of TGV in semiconductors?
In semiconductors, TGV technology is used for high-density integration, high-frequency performance, and improved thermal and mechanical stability in applications like 5G, IoT, and sensor packaging.
What materials are compatible with TGV technology?
TGV technology is compatible with premium materials such as JGS1, JGS2, sapphire, and Corning glass, making it versatile for various high-performance applications.