• 8inch Si Wafer CZ  200mm Prime Grade Silicon Wafer <111>, SSP,DSP P Type,B Dopant for Semiconducter Matrial
  • 8inch Si Wafer CZ  200mm Prime Grade Silicon Wafer <111>, SSP,DSP P Type,B Dopant for Semiconducter Matrial
  • 8inch Si Wafer CZ  200mm Prime Grade Silicon Wafer <111>, SSP,DSP P Type,B Dopant for Semiconducter Matrial
  • 8inch Si Wafer CZ  200mm Prime Grade Silicon Wafer <111>, SSP,DSP P Type,B Dopant for Semiconducter Matrial
8inch Si Wafer CZ  200mm Prime Grade Silicon Wafer <111>, SSP,DSP P Type,B Dopant for Semiconducter Matrial

8inch Si Wafer CZ 200mm Prime Grade Silicon Wafer <111>, SSP,DSP P Type,B Dopant for Semiconducter Matrial

Product Details:

Place of Origin: China
Brand Name: ZMSH
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Detail Information

Material: Single Crystal Silicon Wafer Growth Method: MCZ
Orientation: <100> WARP: 30 µm
BOW:: 30 µm Type/ Dopant: N/ Phosphorus: N/Phosphorus
GBIR/ TTV: 5 µm Notch: Yes
Highlight:

200mm Prime Grade Silicon Wafer

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CZ Prime Grade Silicon Wafer

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8inch Prime Grade Silicon Wafer

Product Description

8inch si wafer CZ 200mm Prime Grade Silicon Wafer <100>, SSP,DSP P type,B dopant,for semiconducter matrial

 

Product Introduction: 8-Inch (200mm) Prime Grade Silicon Wafer

Silicon wafers serve as the cornerstone of the semiconductor industry, facilitating the creation of cutting-edge technologies that drive modern innovation. The 8-Inch (200mm) Prime Grade Silicon Wafer represents the pinnacle of material and manufacturing excellence, specifically designed for semiconductor fabrication and related applications. With superior material properties, precise dimensions, and impeccable surface quality, these wafers cater to the demanding needs of industries such as microchip production, MEMS manufacturing, and photovoltaic systems.

Manufactured using the Czochralski (CZ) process, this wafer features a <100> crystal orientation, P-type doping with boron, and options for single-side polished (SSP) or double-side polished (DSP) surfaces. Its premium epi-ready surface, superior flatness, and minimal particle contamination make it a trusted choice for leading semiconductor fabs, R&D institutions, and educational facilities globally.

 

8inch Si Wafer CZ  200mm Prime Grade Silicon Wafer <111>, SSP,DSP P Type,B Dopant for Semiconducter Matrial 0


1. Key Specifications

Specification Value
Diameter 200 mm ± 0.2 mm
Growth Method Czochralski (CZ)
BOW ≤30 µm
WARP ≤30 µm
Total Thickness Variation (TTV) ≤5 µm
Particles ≤50 (≥0.16 µm)
Oxygen Concentration ≤18 ppma
Carbon Concentration ≤1 ppma
Surface Roughness (Ra) ≤5 Å

These specifications demonstrate the wafer’s outstanding dimensional precision, structural integrity, and chemical purity, essential for advanced manufacturing processes.


2. Key Features

2.1 Premium Quality

Our silicon wafers are made from brand-new, virgin monocrystalline silicon, ensuring unparalleled purity and reliability. This guarantees optimal performance across all stages of semiconductor manufacturing.

2.2 Epi-Ready Surface

Each wafer is polished to achieve a high-grade epi-ready surface, making it suitable for epitaxial deposition and other critical processes. The ultra-smooth surface minimizes defects and enhances the yield of downstream processes.

2.3 Exceeds Industry Standards

Our 8-inch silicon wafers meet and often exceed SEMI M1-0302 standards, reflecting their superior mechanical and electrical properties. This ensures compatibility with global semiconductor manufacturing equipment and techniques.

2.4 Comprehensive Quality Control

Every wafer undergoes meticulous inspection and testing for parameters such as TTV, BOW, WARP, particle density, and resistivity uniformity. This rigorous quality assurance process ensures defect-free and reliable wafers for every application.

2.5 Secure Packaging

To prevent contamination and physical damage, the wafers are packaged in ultra-clean PP cassettes, sealed in antistatic double-bags under class 100 cleanroom conditions. This ensures the wafers arrive in pristine condition, ready for immediate use.

2.6 Cost-Effective Solutions

Our wafers are competitively priced, with quantity discounts available for bulk orders. This makes them an excellent choice for both industrial-scale production and research projects.

2.7 Certificate of Conformance (COC)

Each shipment includes a Certificate of Conformance, verifying the wafers’ specifications and compliance with industry standards. This documentation provides customers with peace of mind regarding the product's quality and authenticity.


3. Applications

The versatility and high performance of the 8-inch Prime Grade Silicon Wafer make it suitable for a wide array of applications:

3.1 Semiconductor Manufacturing

  • Microchip Production and IC Fabrication:
    The wafer’s <111> crystal orientation and high purity are ideal for the manufacture of integrated circuits, processors, and memory chips, supporting advancements in computing and telecommunications.

  • Power Semiconductor Devices:
    Its stable electrical properties and minimal defects make it a trusted choice for creating insulated-gate bipolar transistors (IGBTs) and metal-oxide-semiconductor field-effect transistors (MOSFETs).

3.2 MEMS and Sensors

The exceptional flatness and precise dimensions of these wafers are critical for fabricating MEMS devices, including accelerometers, gyroscopes, and pressure sensors.

3.3 Photonics and Optoelectronics

  • LED Lighting and Laser Diodes:
    The wafers’ minimal surface roughness and low impurity levels are crucial for efficient light emission and reliable device performance.
  • Optical Equipment Components:
    They serve as a substrate for manufacturing high-precision lenses and mirrors in optical systems.

3.4 Solar Photovoltaic Applications

With their superior crystal quality and consistent electrical properties, these wafers are used to produce high-efficiency photovoltaic cells.

3.5 Research and Development

Their customizable specifications and availability in smaller quantities make them a preferred choice for R&D projects in universities, pilot lines, and innovation labs.


4. Advantages of the 8-Inch Prime Grade Silicon Wafer

4.1 Exceptional Purity and Flatness

The wafers exhibit ultra-low levels of oxygen (≤18 ppma) and carbon (≤1 ppma) contamination, ensuring enhanced device performance and reliability. Flatness parameters such as TTV, BOW, and WARP are maintained within tight tolerances to support critical photolithography and thin-film deposition processes.

4.2 Enhanced Surface Quality

The surface roughness (Ra ≤ 5 Å) is optimized to enable seamless epitaxial growth, improving yields and reducing production costs in high-volume manufacturing.

4.3 Global Trust and Compatibility

These wafers are widely used by semiconductor fabs, R&D centers, and academic institutions worldwide, thanks to their compatibility with standard processing equipment and international quality benchmarks.

4.4 Versatile Customization

From resistivity adjustments to oxide layer deposition, these wafers can be tailored to meet specific customer requirements, ensuring suitability for a broad spectrum of applications.


5. Manufacturing Process

The Czochralski (CZ) process is employed to grow large monocrystalline silicon ingots. This advanced technique ensures the creation of a uniform crystal lattice structure with minimal defects. Post-ingot growth, the wafers are sliced, polished, and subjected to stringent quality control protocols. The final product is an epitome of precision engineering, delivering exceptional performance across various applications.


6. Environmental Commitment

Our manufacturing processes are designed to minimize environmental impact. The wafers are produced in ISO-certified facilities adhering to RoHS and other environmental standards. This commitment ensures that our products meet both performance and sustainability goals.


7. Conclusion

The 8-Inch (200mm) Prime Grade Silicon Wafer exemplifies excellence in material science and semiconductor manufacturing. Its high-quality monocrystalline silicon substrate, precise dimensions, and exceptional surface properties make it a vital component for advanced technology development.

With its versatility, reliability, and adherence to industry standards, this wafer is a trusted choice for applications ranging from semiconductor production to R&D prototyping. Whether you are manufacturing next-generation chips, creating MEMS devices, or exploring new horizons in photonics, these wafers provide the foundation for success.

By choosing our 8-inch silicon wafers, you are investing in a product that combines technical superiority, global trust, and competitive pricing—a truly unbeatable combination in the semiconductor industry.

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