• 6'' C Plane SSP/DSP Sapphire Wafer , Sapphire Material 150mm 650um/1000um Thickness
  • 6'' C Plane SSP/DSP Sapphire Wafer , Sapphire Material 150mm 650um/1000um Thickness
  • 6'' C Plane SSP/DSP Sapphire Wafer , Sapphire Material 150mm 650um/1000um Thickness
  • 6'' C Plane SSP/DSP Sapphire Wafer , Sapphire Material 150mm 650um/1000um Thickness
6'' C Plane SSP/DSP Sapphire Wafer , Sapphire Material 150mm 650um/1000um Thickness

6'' C Plane SSP/DSP Sapphire Wafer , Sapphire Material 150mm 650um/1000um Thickness

Product Details:

Place of Origin: china
Brand Name: zmkj
Model Number: 6INCH

Payment & Shipping Terms:

Minimum Order Quantity: 10pcs
Price: by case
Packaging Details: in 25pcs cassette wafer box under 100grade cleaning room
Delivery Time: 3-5weeks
Payment Terms: T/T, Western Union, MoneyGram
Supply Ability: 1000pcs per month
Get Best Price Contact Now

Detail Information

Material: Sapphire Single Crystal Orientation: C-axis
Surface: Ssp Or Dsp Thickness: 1.0mm Or Customized
Application: Led Or Optical Glass Growth Method: Ky
High Light:

sapphire wafer

,

silicon substrate

Product Description

2inch /3inch 4inch /5inch  C-axis/ a-axis/  r-axis/ m-axis 6"/6inch dia150mm C-plane Sapphire SSP/DSP wafers with 650um/1000um Thickness

About synthetic sapphire crystal

The Kyropoulos process (KY process) for sapphire crystal growth is currently used by many companies in China to produce sapphire for the electronics and optics industries.
High-purity, aluminum oxide is melted in a crucible at over 2100 degrees Celsius. Typically the crucible is made of tungsten or molybdenum. A precisely oriented seed crystal is dipped into the molten alumina. The seed crystal is slowly pulled upwards and may be rotated simultaneously. By precisely controlling the temperature gradients, rate of pulling and rate of temperature decrease, it is possible to produce a large, single-crystal, roughly cylindrical ingot from the melt.
After single crystal sapphire boules are grown, they are core-drilled into cylindrical rods, The rods are sliced up into the desired window thickness and finally polished to the desired surface finish.

6'' C Plane SSP/DSP Sapphire Wafer , Sapphire Material 150mm 650um/1000um Thickness 0

Use as substrate for semiconducting circuits
Thin sapphire wafers were the first successful use of an insulating substrate upon which to deposit silicon to make the integrated circuits known as silicon on sapphire or "SOS", Besides its excellent electrical insulating properties, sapphire has high thermal conductivity. CMOS chips on sapphire are especially useful for high-power radio-frequency (RF) applications such as those found in cellular telephones, public-safety band radios, and satellite communication systems.
Wafers of single-crystal sapphire are also used in the semiconductor industry as substrates for the growth of devices based on gallium nitride (GaN). The use of sapphire significantly reduces the cost, because it has about one-seventh the cost of germanium. Gallium nitride on sapphire is commonly used in blue light-emitting diodes (LEDs).

Used as a window material
Synthetic sapphire (sometimes referred to as sapphire glass) is commonly used as a window material, because it is both highly transparent to wavelengths of light between 150 nm (UV) and 5500 nm (IR) (the visible spectrum extends about 380 nm to 750 nm, and extraordinarily scratch-resistant. The key benefits of sapphire windows are:
* Very wide optical transmission band from UV to near-infrared
* Significantly stronger than other optical materials or glass windows
* Highly resistant to scratching and abrasion (9 on the Mohs scale of mineral hardness scale, the 3rd hardest natural substance next to moissanite and diamonds)
* Extremely high melting temperature (2030 °C)

Sapphire Properties

GENERAL
Chemical Formula
 
Al2O3
Crystal Stucture
 
Hexagonal System ((hk o 1)
Unit Cell Dimension
 
a=4.758 Å,Å c=12.991 Å, c:a=2.730
PHYSICAL
 
 
Metric
English (Imperial)
Density
 
3.98 g/cc
0.144 lb/in3
Hardness
 
1525 - 2000 Knoop, 9 mhos
3700° F
Melting Point
 
2310 K (2040° C)
 
STRUCTURAL
Tensile Strength
 
275 MPa to 400 MPa
40,000 to 58,000 psi
 
at 20°
400 MPa
58,000 psi (design min.)
 
at 500° C
275 MPa
40,000 psi (design min.)
 
at 1000° C
355 MPa
52,000 psi (design min.)
Flexural Stength
 
480 MPa to 895 MPa
70,000 to 130,000 psi
Compression Strength
 
2.0 GPa (ultimate)
300,000 psi (ultimate)

 

CATALOGU  & Stcok List
 

Standard wafer

2 inch C-plane sapphire wafer SSP/DSP
3 inch C-plane sapphire wafer SSP/DSP
4 inch C-plane sapphire wafer SSP/DSP
6 inch C-plane sapphire wafer SSP/DSP
Special Cut
A-plane (1120) sapphire wafer
R-plane (1102) sapphire wafer
M-plane (1010) sapphire wafer
N-plane (1123) sapphire wafer
C-axis with a 0.5°~ 4° offcut, toward A-axis or M-axis
Other customized orientation
Customized Size
10*10mm sapphire wafer
20*20mm sapphire wafer
Ultra thin (100um) sapphire wafer
8 inch sapphire wafer
 
Patterned Sapphire Substrate (PSS)
2 inch C-plane PSS
4 inch C-plane PSS
 
                         2inch 

 DSP C-AXIS 0.1mm/ 0.175mm/0.2mm/0.3mm/0.4mm/0.5mm/1.0mmt  

 SSP C-axis  0.2/0.43mm

(DSP&SSP) A-axis/M-axis/R-axis 0.43mm 

 

                         3inch  

  DSP/ SSP C-axis 0.43mm/0.5mm  

 

                          4Inch 

dsp   c-axis 0.4mm/ 0.5mm/1.0mm

ssp  c-axis  0.5mm/0.65mm/1.0mmt

 

 

                          6inch

 ssp c-axis  1.0mm/1.3mmm

 

dsp c-axis  0.65mm/ 0.8mm/1.0mmt 

 

6'' C Plane SSP/DSP Sapphire Wafer , Sapphire Material 150mm 650um/1000um Thickness 16'' C Plane SSP/DSP Sapphire Wafer , Sapphire Material 150mm 650um/1000um Thickness 2

6'' C Plane SSP/DSP Sapphire Wafer , Sapphire Material 150mm 650um/1000um Thickness 3

Item Parameter Spec Unit
1 Product Name Sapphire Wafer (Al2O3)  
2 Diameter 2” 4” 6” mm
3 Thickness 430± 25 650± 25 1000 ± 25 μm
4 Surface Orientation C-Plane (0001) tilted M-axis 0.2°/0.35°± 0.1° degree
5 Primary Flat A-Axis (11-20) ± 0.2° degree
Orientation Length 16 ± 0.5 31 ± 1.0 47.5 ± 2.0 mm
6 TTV < 10 < 10 < 25 μm
7 Bow -10 ~ 0 -15 ~ 0 -30 ~ 0 μm
8 Warp 10 20 30 μm
9 Roughness Front Side 0.5 0.5 0.5 nm
10 Roughness Back Side 1.0 ± 0.3 μm
11 Wafer Edge R-Type or T-Type  
12 Laser Mark Customize
 

OUR FACTORY

6'' C Plane SSP/DSP Sapphire Wafer , Sapphire Material 150mm 650um/1000um Thickness 4

Payment / Shipping

 

Q: What's the way of shipping and cost?

 

(1) We accept DHL, Fedex, TNT, UPS, EMS, SF and etc.

(2) If you have your own express number, it's great.

(3) Freight=USD35.0(the first weight) + USD12.0/kg

 

Q: How to pay?

 

(1) T/T, PayPal, West Union, MoneyGram and

Assurance payment on Alibaba and etc..

(2) Bank Fee: West Union-USD30.00(≤USD3000.00),

T/T-USD20.00+, PayPal-5%. Please consult the local bank.

 

Q: What's the deliver time?

 

(1) For inventory: the delivery time is 5 workdays.
(2) For customized products: the delivery time is 7 to 25 workdays. According to the quantity.

 

Q: Can I customize the products based on my need?

 

Yes, we can customize the material, specifications and optical coating for your optical components based on your needs.

 

 

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