• 10x10/7x7mm Scientific Lab Equipment Sapphire Glass Laser Cutting Camera Protective Lens
  • 10x10/7x7mm Scientific Lab Equipment Sapphire Glass Laser Cutting Camera Protective Lens
  • 10x10/7x7mm Scientific Lab Equipment Sapphire Glass Laser Cutting Camera Protective Lens
  • 10x10/7x7mm Scientific Lab Equipment Sapphire Glass Laser Cutting Camera Protective Lens
  • 10x10/7x7mm Scientific Lab Equipment Sapphire Glass Laser Cutting Camera Protective Lens
10x10/7x7mm Scientific Lab Equipment Sapphire Glass Laser Cutting Camera Protective Lens

10x10/7x7mm Scientific Lab Equipment Sapphire Glass Laser Cutting Camera Protective Lens

Product Details:

Place of Origin: china
Brand Name: zmkj
Model Number: sapphire laser cut service

Payment & Shipping Terms:

Minimum Order Quantity: 100pcs
Price: by case
Packaging Details: PET Films
Delivery Time: 10-20days
Payment Terms: T/T, Western Union
Supply Ability: 50000pcs
Get Best Price Contact Now

Detail Information

Material: Sapphire Capacity: 0.2-1.5mm
Surface: SSP/ DSP Condition: Without Chipping
Laser Type: Vertical Picosecond
High Light:

light transmittance meter

,

uv transmittance meter

Product Description

 

 

 

customized size 10x10/7x7mm sapphire glass laser cutting for phone camera protective lens

Product Description

 

Product Application

Micro cutting and drilling for cell phone cover, optical glass, sapphire, semiconductor, chip. Specific application:

1. Fingerprint indentification chips cutting. Cell phone plate and optical lens cutting.

2. Organic inorganic flexible display circuit etching and cutting.

3. Optical lens and LCD panel cutting

TECHNICAL SPECIFICATIONS
Model No
HRPC-50W Picosecond Laser Micro Cutting Drilling Machine
Laser wavelength
355 nm UV
Positioning accuracy
±3µm
Repeat accuracy
±1µm
Processing Size
250*250 mm
Cooling Way
Air Cooling
System Processing Precision
±20µm
Vibration Acceleration
<0.05G
Focus Method
Following and Automatic Adjust Focus

 

Main Features

1. Picosecond laser with ultrashort pulse and no heat conduction, is suitable for high speed cutting and drilling organic or inorgannic materials. The min. chopping or heat affected zone is less than 10um.

2. One laser source with beam split technology, dual laser head processing with efficiency doubled.

3. CCD visual home target, one time process 650*450mm, stitching precision XY platform less than 3um .

4. Automatically cleaning, visual detection and sorting, automatic feeding and blanking.

 

 

Actual cutting effect

 

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