• BAW Devices Dia 50.8mm 1 Inch  AlN Aluminum Nitride Wafer
  • BAW Devices Dia 50.8mm 1 Inch  AlN Aluminum Nitride Wafer
BAW Devices Dia 50.8mm 1 Inch  AlN Aluminum Nitride Wafer

BAW Devices Dia 50.8mm 1 Inch AlN Aluminum Nitride Wafer

Product Details:

Place of Origin: China
Brand Name: ZMKJ
Model Number: UTI-AlN-1inch single crystal

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: by case
Packaging Details: single wafer container in cleaning room
Delivery Time: in 30days
Payment Terms: T/T, Western Union, paypal
Supply Ability: 10pcs/month
Get Best Price Contact Now

Detail Information

Material: AlN Crystal Thickness: 400um
Orientation: 0001 Application: High Power/high Frequency Electronic Devices
Application 2: 5G Saw/BAW Devices Ra: 0.5nm
Surface Polished: Al Face Cmp, N-face Mp Crystal Type: 2H
High Light:

AlN aluminum nitride wafer

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50.8mm aluminum nitride wafer

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BAW Devices AlN wafer

Product Description

dia50.8mm 2inch 1inch AlN substrate/AlN single crystal wafers

10x10mm or diameter 10mm dia25.4mm dia30mm, dia45mm, dia50.8mm  AlN substrate AlN single crystal wafers

 

Applications of   AlN template
 
we have developed a serials of proprietary processes and technologies to fabricate
high-quality AlN templates. At present, Our OEM is the only company worldwide who can produce 2-6 inch AlN
templates in large-scale industrial production capability with capacity of 300,000 pieces in 2020 to meet explosive
market demand from UVC-LED, 5G wireless communication, UV detectors and sensors etc
 
We currently provide customers with standardized 10x10mm/Φ10mm/Φ15mm/Φ20mm/Φ25.4mm/Φ30mm/Φ50.8mm high quality nitrogen
Aluminum single crystal substrate products, and can also provide customers with 10-20mm non-polar
M-plane aluminum nitride single crystal substrate, or customize non-standard 5mm-50.8mm to customers
Polished aluminum nitride single crystal substrate. This product is widely used as a high-end substrate material
Used in UVC-LED chips, UV detectors, UV lasers, and various high power
/High temperature/high frequency electronic device field.
 
 
Characteristic Specification
  • Model                                                           UTI-AlN-10x10B-single crystal
  • Diameter                                                           10x10±0.5mm ; or dia10mm,  dia25.4mm, or dia30mm, or dia45mm; 
  • Substrate thickness (µm)                                      400 ± 50
  • Orientation                                                        C-axis [0001] +/- 0.5°

     Quality Grade              S-grade(super)    P-grade(production)       R-grade(Research) 

  • Cracks                                                  None                      None                                   <3mm 
  • FWHM-2θXRD@(0002)                  <150                            <300                                    <500
  • FWHM-HRXRD@(10-12)                 <100                         <200                                     <400
  • Surface Roughness [5×5µm] (nm)          Al-face  CMP <0.5nm;     N-face(back surface) MP <1.2um; 
  • Usable area                                       90%
  • Absorbance                              <50 ;                   <70 ;                              <100;
  • 1st  OF length orientation                                         {10-10} ±5°;
  • TTV (µm)                                                                       ≤30
  • Bow (µm)                                                                        ≤30
  • Warp (µm)                                                                    -30~30
  • Note: These characterization results may vary slightly depending on the equipments and/or software employed
BAW Devices Dia 50.8mm 1 Inch  AlN Aluminum Nitride Wafer 0

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impurity element    C O Si B Na W P S Ti Fe
PPMW                        27 90 5.4 0.92 0.23 <0.1 <0.1 <0.5 0.46 <0.5
 
 
Crystal structure

Wurtzite

Lattice constant (Å) a=3.112, c=4.982
Conduction band type Direct bandgap
Density (g/cm3) 3.23
Surface microhardness (Knoop test) 800
Melting point (℃) 2750 (10-100 bar in N2)
Thermal conductivity (W/m·K) 320
Band gap energy (eV) 6.28
Electron mobility (V·s/cm2) 1100
Electric breakdown field (MV/cm) 11.7

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